EP 1629703 A1 20060301 - METHOD FOR THE STRUCTURED METAL-COATING OF POLYMERIC AND CERAMIC SUPPORT MATERIALS, AND COMPOUND THAT CAN BE ACTIVATED AND IS USED IN SAID METHOD
Title (en)
METHOD FOR THE STRUCTURED METAL-COATING OF POLYMERIC AND CERAMIC SUPPORT MATERIALS, AND COMPOUND THAT CAN BE ACTIVATED AND IS USED IN SAID METHOD
Title (de)
VERFAHREN ZUR STRUKTURIERTEN METALLISIERUNG VON POLYMEREN UND KERAMISCHEN TRÄGERMATERIALIEN UND AKTIVIERBARE VERBINDUNG ZUR VERWENDUNG IN DIESEM VERFAHREN
Title (fr)
PROCEDE DE METALLISATION STRUCTUREE DE MATERIAUX-SUPPORTS POLYMERES ET CERAMIQUES, ET COMPOSE ACTIVABLE DESTINE A ETRE UTILISE AU COURS DE CE PROCEDE
Publication
Application
Priority
- DE 2004001171 W 20040604
- DE 10325520 A 20030605
Abstract (en)
[origin: WO2004110118A1] The invention relates to a method for producing highly adhesive conductive structures on non-conductive supports, especially for use in electric circuits, and a surface activating compound which is used in said method. The inventive method comprises the following steps: a surface activating compound is applied and is selectively irradiated; and the irradiated areas are then metal-coated in a currentless manner so as to form metallic structures.
IPC 1-7
IPC 8 full level
C23C 18/16 (2006.01); C23C 18/30 (2006.01); H05K 3/18 (2006.01)
CPC (source: EP US)
C23C 18/1608 (2013.01 - EP US); C23C 18/1612 (2013.01 - EP US); C23C 18/182 (2013.01 - EP US); C23C 18/1831 (2013.01 - EP US); C23C 18/1834 (2013.01 - EP US); C23C 18/1851 (2013.01 - EP US); C23C 18/1868 (2013.01 - EP US); C23C 18/1879 (2013.01 - EP US); C23C 18/1882 (2013.01 - EP US); C23C 18/24 (2013.01 - EP US); C23C 18/30 (2013.01 - EP US); H05K 3/185 (2013.01 - EP US); H05K 2203/121 (2013.01 - EP US)
Citation (search report)
See references of WO 2004110118A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004110118 A1 20041216; CN 1799293 A 20060705; DE 112004001472 D2 20060420; EP 1629703 A1 20060301; JP 2006526889 A 20061124; US 2007092638 A1 20070426
DOCDB simple family (application)
DE 2004001171 W 20040604; CN 200480015186 A 20040604; DE 112004001472 T 20040604; EP 04738625 A 20040604; JP 2006508122 A 20040604; US 55911204 A 20040604