EP 1630258 A1 20060301 - Method for the electrolytic deposition of copper
Title (en)
Method for the electrolytic deposition of copper
Title (de)
Verfahren zur elektrolytischen Abscheidung von Kupfer
Title (fr)
Procédé pour la déposition électrolytique de cuivre
Publication
Application
Priority
DE 102004041701 A 20040828
Abstract (en)
The flow rate of the electrolyte of the matting process is significantly increased by treating with an electrolyte containing copper in an acid (Copper alkydsulphate).
IPC 8 full level
C25D 3/38 (2006.01)
CPC (source: EP US)
C25D 3/38 (2013.01 - EP US)
Citation (search report)
- [XA] EP 1408141 A1 20040414 - ENTHONE [US]
- [XA] US 6676823 B1 20040113 - BOKISA GEORGE [US]
- [XA] US 6491806 B1 20021210 - DUBIN VALERY [US], et al
- [A] US 4036711 A 19770719 - KARDOS OTTO, et al
- [A] US 4134803 A 19790116 - ECKLES WILLIAM E, et al
Designated contracting state (EPC)
DE ES FR GB NL
DOCDB simple family (publication)
EP 1630258 A1 20060301; EP 1630258 B1 20130227; CN 1740399 A 20060301; DE 102004041701 A1 20060302; ES 2402688 T3 20130507; JP 2006063450 A 20060309; JP 4283256 B2 20090624; US 2006049058 A1 20060309
DOCDB simple family (application)
EP 05018241 A 20050823; CN 200510092292 A 20050826; DE 102004041701 A 20040828; ES 05018241 T 20050823; JP 2005243009 A 20050824; US 21442105 A 20050829