EP 1634673 A1 20060315 - METHOD OF PRODUCING LASER-PROCESSED PRODUCT AND ADHESIVE SHEET, FOR LASER PROCESSING USED THEREFOR
Title (en)
METHOD OF PRODUCING LASER-PROCESSED PRODUCT AND ADHESIVE SHEET, FOR LASER PROCESSING USED THEREFOR
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES MIT EINEM LASER BEARBEITETEN PRODUKTS UND EINER DAFÜR VERWENDETEN KLEBEFOLIE ZUR LASERBEARBEITUNG
Title (fr)
METHODE DE PRODUCTION D'UN PRODUIT TRAITE PAR LASER ET D'UNE FEUILLE ADHESIVE, POUR UN TRAITEMENT LASER UTILISE POUR CE PRODUIT
Publication
Application
Priority
- JP 2004005554 W 20040419
- JP 2003120927 A 20030425
- JP 2003430093 A 20031225
- JP 2004095875 A 20040329
- JP 2004095785 A 20040329
- JP 2004094732 A 20040329
- JP 2004095492 A 20040329
- JP 2004094635 A 20040329
- JP 2004094431 A 20040329
Abstract (en)
A manufacturing method of laser processed parts is characterized in that at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet (2) for laser processing, using a material having specified physical properties, and this method comprises a step of adhering the pressure-sensitive adhesive sheet (2) for laser processing to the laser beam exit side of the work (1) by way of the pressure-sensitive adhesive layer, a step of processing the work by irradiating the work with a laser beam (6) of within 2 times of the irradiation intensity for forming a through-hole in the work (1), at higher than the irradiation intensity of threshold for inducing ablation of the work (1), and a step of peeling the pressure-sensitive adhesive sheet (2) for laser processing from the work (1) after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.
IPC 1-7
IPC 8 full level
B23K 26/18 (2006.01); H01L 21/301 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP KR US)
B23K 26/18 (2013.01 - EP KR US); C09J 9/00 (2013.01 - KR); H05K 3/0029 (2013.01 - EP KR US); H05K 2203/0214 (2013.01 - EP KR US); Y10T 156/1052 (2015.01 - EP US); Y10T 428/28 (2015.01 - EP US); Y10T 428/2809 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1634673 A1 20060315; EP 1634673 A4 20090408; KR 101070069 B1 20111004; KR 20060008921 A 20060127; MY 137997 A 20090430; TW 200501251 A 20050101; TW I350562 B 20111011; US 2006246279 A1 20061102; US 2010273313 A1 20101028; US 8778118 B2 20140715; WO 2004096483 A1 20041111
DOCDB simple family (application)
EP 04728276 A 20040419; JP 2004005554 W 20040419; KR 20057020275 A 20051025; MY PI20041507 A 20040423; TW 93111442 A 20040423; US 55454005 A 20051024; US 82037510 A 20100622