EP 1636844 A2 20060322 - STRUCTURED SEMICONDUCTOR ELEMENT FOR REDUCING CHARGING EFFECTS
Title (en)
STRUCTURED SEMICONDUCTOR ELEMENT FOR REDUCING CHARGING EFFECTS
Title (de)
STRUKTURIERTES HALBLEITERELEMENT ZUR REDUZIERUNG VON CHARGINGEFFEKTEN
Title (fr)
ELEMENT A SEMI-CONDUCTEUR STRUCTURE POUR REDUIRE DES EFFETS DE CHARGE
Publication
Application
Priority
- EP 2004050884 W 20040521
- DE 10328007 A 20030621
Abstract (en)
[origin: WO2004114406A3] The invention relates to a semiconductor circuit element (1) for reducing undesirable charging effects, in particular a connection element of test structures for semiconductor circuits. The surface (4) of said semiconductor element (1) comprises printed conductors (3) that are electrically insulated from the remainder of the surface (5) of the semiconductor element (1). In said element, only the printed conductors (3) are connected to semiconductor circuit elements (8) that are situated downstream.
IPC 1-7
IPC 8 full level
H01L 23/482 (2006.01); H01L 23/485 (2006.01); H01L 23/544 (2006.01); H01L 23/58 (2006.01); H01L 23/62 (2006.01)
CPC (source: EP US)
H01L 22/34 (2013.01 - EP US); H01L 23/62 (2013.01 - EP US); H01L 24/05 (2013.01 - EP US); H01L 2224/05093 (2013.01 - EP US); H01L 2224/05096 (2013.01 - EP US); H01L 2224/05624 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01052 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/30105 (2013.01 - EP US)
C-Set (source: EP US)
Citation (search report)
See references of WO 2004114406A2
Citation (examination)
US 2002079584 A1 20020627 - MATSUNAGA NORIAKI [JP]
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 2004114406 A2 20041229; WO 2004114406 A3 20050428; DE 10328007 A1 20050113; EP 1636844 A2 20060322; US 2006097253 A1 20060511; US 2010019398 A1 20100128; US 7646104 B2 20100112
DOCDB simple family (application)
EP 2004050884 W 20040521; DE 10328007 A 20030621; EP 04741625 A 20040521; US 31453805 A 20051220; US 57527509 A 20091007