EP 1637017 A2 20060322 - METHOD FOR PRODUCTION OF PIECES FOR PASSIVE ELECTRONIC COMPONENTS
Title (en)
METHOD FOR PRODUCTION OF PIECES FOR PASSIVE ELECTRONIC COMPONENTS
Title (de)
VERFAHREN ZUR HERSTELLUNG DER BAUTEILE FÜR PASSIVE ELEKTRONISCHE BAUELEMENTE
Title (fr)
PROCEDE DE FABRICATION DE PIECES POUR COMPOSANTS ELECTRONIQUES PASSIFS
Publication
Application
Priority
- FR 2004001556 W 20040622
- FR 0307563 A 20030623
Abstract (en)
[origin: WO2005002308A2] The invention relates to a method for production of pieces for passive electronic components in which: a layered strip (1) is produced, made from at least one stack of a thin metal strip and a layer of adhesive material, at least one piece (6) is cut from the layered strip (1), the cutting being carried out by a method including at least one etching step with sand. The invention further relates to the pieces obtained.
IPC 1-7
IPC 8 full level
H01F 10/13 (2006.01); H01F 41/04 (2006.01); H01F 17/00 (2006.01); H01F 41/02 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP KR US)
H01F 10/12 (2013.01 - KR); H01F 10/13 (2013.01 - KR); H01F 10/131 (2013.01 - EP US); H01F 10/265 (2013.01 - EP US); H01F 41/046 (2013.01 - EP US); H01F 41/14 (2013.01 - KR); B82Y 25/00 (2013.01 - KR); H01F 10/138 (2013.01 - EP US); H01F 17/0033 (2013.01 - EP US); H01F 41/0233 (2013.01 - EP US); H01F 41/042 (2013.01 - EP US); H05K 3/0044 (2013.01 - EP US); Y10T 29/435 (2015.01 - EP US); Y10T 29/49002 (2015.01 - EP US); Y10T 29/49126 (2015.01 - EP US); Y10T 29/49155 (2015.01 - EP US); Y10T 29/49156 (2015.01 - EP US); Y10T 83/0591 (2015.04 - EP US)
Citation (search report)
See references of WO 2005002308A2
Citation (examination)
- EP 0336771 A2 19891011 - INT STANDARD ELECTRIC CORP [US]
- US 4364020 A 19821214 - LIN KOU C, et al
- WO 02084676 A1 20021024 - MITSUI CHEMICALS INC [JP], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2856552 A1 20041224; FR 2856552 B1 20051021; BR PI0411684 A 20060829; CA 2529899 A1 20050106; CA 2529899 C 20130115; CA 2774224 A1 20050106; CN 1830232 A 20060906; CN 1830232 B 20120530; EP 1637017 A2 20060322; JP 2007520872 A 20070726; JP 2009224800 A 20091001; JP 4381414 B2 20091209; JP 4917632 B2 20120418; KR 101104385 B1 20120116; KR 20060017651 A 20060224; US 2007119284 A1 20070531; US 2009314521 A1 20091224; US 7640641 B2 20100105; US 8362361 B2 20130129; WO 2005002308 A2 20050106; WO 2005002308 A3 20050317
DOCDB simple family (application)
FR 0307563 A 20030623; BR PI0411684 A 20040622; CA 2529899 A 20040622; CA 2774224 A 20040622; CN 200480021471 A 20040622; EP 04767412 A 20040622; FR 2004001556 W 20040622; JP 2006516309 A 20040622; JP 2009156547 A 20090701; KR 20057024814 A 20040622; US 55052909 A 20090831; US 56143904 A 20040622