EP 1639643 A1 20060329 - OPTIMIZED MULTI-APPLICATION ASSEMBLY
Title (en)
OPTIMIZED MULTI-APPLICATION ASSEMBLY
Title (de)
OPTIMIERTE MULTIFUNKTIONSANORDNUNG
Title (fr)
ASSEMBLAGE MULTIAPPLICATION OPTIMIS
Publication
Application
Priority
- IB 2004002022 W 20040616
- EP 03300035 A 20030620
- EP 04736936 A 20040616
Abstract (en)
[origin: WO2004114407A1] The invention relates to a microelectronic chip assembly ASS comprising at least three microelectronic chip ICH, TCH, BCH stacked together and on which integrated devices are formed. At least one of the chip, called intermediate chip ICH, includes via holes VH running through said chip ICH and filled with conductive material is realized from a high-ohmic substrate on which are formed devices for the functioning of at least two other microelectronic chips, called top chip TCH and bottom chip BCH. Said top and bottom chips TCH and BCH are connected by flip chip bonding respectively on top face TF and bottom face BF of said intermediate chip ICH and said via holes VH are electrically connected to pads of said top and bottom chips TCH and BCH.
IPC 1-7
IPC 8 full level
H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 27/08 (2006.01); H10B 12/00 (2023.01)
CPC (source: EP KR US)
H01L 21/52 (2013.01 - KR); H01L 21/76898 (2013.01 - EP US); H01L 23/481 (2013.01 - EP US); H01L 27/0805 (2013.01 - EP US); H01L 2224/05568 (2013.01 - EP US); H01L 2224/05573 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/16145 (2013.01 - EP); H01L 2224/16245 (2013.01 - EP); H01L 2224/17181 (2013.01 - EP); H01L 2224/73253 (2013.01 - EP); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01087 (2013.01 - EP US); H01L 2924/3011 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004114407 A1 20041229; CN 100365798 C 20080130; CN 1809919 A 20060726; CN 1809925 A 20060726; EP 1639643 A1 20060329; JP 2007516588 A 20070621; KR 20060026434 A 20060323; US 2007018298 A1 20070125
DOCDB simple family (application)
IB 2004002022 W 20040616; CN 200480017089 A 20040611; CN 200480017351 A 20040616; EP 04736936 A 20040616; JP 2006516563 A 20040616; KR 20057024491 A 20051220; US 56229505 A 20051222