EP 1641596 A1 20060405 - DIAMOND CONDITIONING OF SOFT CHEMICAL MECHANICAL PLANARIZATION/POLISHING (CMP) POLISHING PADS
Title (en)
DIAMOND CONDITIONING OF SOFT CHEMICAL MECHANICAL PLANARIZATION/POLISHING (CMP) POLISHING PADS
Title (de)
DIAMANTABRICHTUNG VON WEICHEN CMP-POLIERKISSEN (CMP - CHEMISCH-MECHANISCHES PLANARISIEREN/POLIEREN)
Title (fr)
CONDITIONNEMENT AU DIAMANT DE TAMPONS DE POLISSAGE/PLANARISATION MECANO-CHIMIQUE (CMP)
Publication
Application
Priority
- US 0339969 W 20031215
- US 40257803 A 20030328
Abstract (en)
[origin: US2004192178A1] Conditioning of chemical mechanical planarization (CMP) using conventional diamond-embedded abrasive strips are well suited to condition conventional "hard" polishing but not soft polishing pads because the diamonds not only remove waste material, but they also damage the polishing surface of the pad. Embodiments of the present invention condition soft polishing pads using diamond strips without damaging the soft polishing pad.
IPC 1-7
IPC 8 full level
B24B 53/007 (2006.01); B24B 53/017 (2012.01)
CPC (source: EP KR US)
B24B 37/04 (2013.01 - KR); B24B 53/007 (2013.01 - KR); B24B 53/017 (2013.01 - EP KR US)
Citation (search report)
See references of WO 2004094106A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2004192178 A1 20040930; AU 2003297156 A1 20041119; CN 1694783 A 20051109; EP 1641596 A1 20060405; KR 100818591 B1 20080402; KR 20050112113 A 20051129; TW 200418612 A 20041001; TW 200705376 A 20070201; TW I286502 B 20070911; TW I303406 B 20081121; US 2006183410 A1 20060817; WO 2004094106 A1 20041104
DOCDB simple family (application)
US 40257803 A 20030328; AU 2003297156 A 20031215; CN 200380100789 A 20031215; EP 03816708 A 20031215; KR 20057018192 A 20050927; TW 92136019 A 20031218; TW 95113436 A 20031218; US 0339969 W 20031215; US 40244906 A 20060412