Global Patent Index - EP 1642336 A1

EP 1642336 A1 20060405 - METHOD FOR INTERCONNECTING ACTIVE AND PASSIVE COMPONENTS, AND A RESULTING THIN HETEROGENEOUS COMPONENT

Title (en)

METHOD FOR INTERCONNECTING ACTIVE AND PASSIVE COMPONENTS, AND A RESULTING THIN HETEROGENEOUS COMPONENT

Title (de)

METHODE ZUM VERBINDEN AKTIVER UND PASSIVER BAUTEILE UND DARAUS ENTSTANDENES HETEROGENES BAUTEIL GERINGER DICKE

Title (fr)

PROCEDE D INTERCONNEXION DE COMPOSANTS ACTIF ET PASSIF ET CO MPOSANT HETEROGENE A FAIBLE EPAISSEUR EN RESULTANT

Publication

EP 1642336 A1 20060405 (FR)

Application

EP 04766105 A 20040630

Priority

  • EP 2004051314 W 20040630
  • FR 0307977 A 20030701

Abstract (en)

[origin: WO2005004237A1] The invention relates to a method for interconnecting thin active and passive composites having two or three dimensions, and to the resulting thin heterogeneous components. According to the invention, the invention involves: the positioning and fixing (11) of at least one active component and one passive component to a supporting surface (23), the contacts being in contact with the support; the deposition (12) of a polymer layer (24) onto the assembly consisting of the support and of these components; the withdrawal (14) of the support; the redistribution of the contacts between the composites and/or toward the periphery by means of metallic conductors (26) arranged according to a predetermined configuration, whereby making it possible to obtain a reconstituted heterogeneous structure; heterogeneous thinning (16) of this structure by non-selective surface finishing of the polymer coating and of at least one passive component (22).

IPC 1-7

H01L 23/538; H01L 21/98; H01L 21/60; H01L 21/68

IPC 8 full level

H01L 21/60 (2006.01); H01L 21/68 (2006.01); H01L 21/98 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2006.01)

CPC (source: EP US)

H01G 4/228 (2013.01 - EP US); H01G 4/40 (2013.01 - EP US); H01L 21/568 (2013.01 - EP US); H01L 21/6835 (2013.01 - EP US); H01L 23/5389 (2013.01 - EP US); H01L 24/85 (2013.01 - EP US); H01L 24/96 (2013.01 - EP US); H01L 24/97 (2013.01 - EP US); H01L 25/16 (2013.01 - EP US); H01L 25/50 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/73 (2013.01 - EP US); H01L 2224/04105 (2013.01 - EP); H01L 2224/16225 (2013.01 - EP US); H01L 2224/24137 (2013.01 - EP); H01L 2224/32145 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48145 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/73267 (2013.01 - EP); H01L 2224/85001 (2013.01 - EP US); H01L 2224/97 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01028 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01056 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01087 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/19042 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/19105 (2013.01 - EP US); H01L 2924/30105 (2013.01 - EP US); H01L 2924/30107 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US)

Citation (search report)

See references of WO 2005004237A1

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

FR 2857157 A1 20050107; FR 2857157 B1 20050923; EP 1642336 A1 20060405; US 2007117369 A1 20070524; US 7635639 B2 20091222; WO 2005004237 A1 20050113

DOCDB simple family (application)

FR 0307977 A 20030701; EP 04766105 A 20040630; EP 2004051314 W 20040630; US 56268504 A 20040630