EP 1642713 A1 20060405 - Method for plating and grinding a roll before forming printing cells
Title (en)
Method for plating and grinding a roll before forming printing cells
Title (de)
Plattierungs- und Schliefverfahren eines Zylinders vor Erzeugung von Drucknäpfchen
Title (fr)
Procédé de placage et de rectification d'un rouleau avant la formation de cellules pour l'impression
Publication
Application
Priority
EP 04023213 A 20040929
Abstract (en)
There are provided a plating method for a roll and a grinding method before a cell is formed in which copper sulfate plating having a uniform thickness without any particles or pits can be applied to the roll for a gravure printing, both a middle finish grinding and a mirror surface finish grinding not depending on a grinding stone grinding can be carried out in a short period of time and a high quality roll can be provided. The grinding is carried out after applying the copper sulfate plating to the roll to attain a mirror surface finish state. The copper sulfate plating is carried out in such a way that non-soluble anode having a length more than the maximum roll length is ascended to the rotating process roll and approached to the lower surface of the roll, plating liquid having some avoidable impurities becoming a cause of particles or pits removed through a filter so as to perform a plating having no thickened portions at both ends of the roll.
IPC 8 full level
B41C 1/10 (2006.01); B41N 1/20 (2006.01); B41N 3/04 (2006.01); B41N 7/00 (2006.01)
CPC (source: EP)
B41N 1/20 (2013.01); B41N 3/03 (2013.01); B41N 3/04 (2013.01); B41N 7/00 (2013.01); B41C 1/05 (2013.01); B41N 2207/02 (2013.01); B41N 2207/10 (2013.01)
Citation (applicant)
- JP H10193551 A 19980728 - THINK LABS KK
- JP H10193552 A 19980728 - THINK LABS KK
- JP 2000062342 A 20000229 - THINK LABS KK
- JP 2001179923 A 20010703 - THINK LABS KK
- JP 2001187440 A 20010710 - THINK LABS KK
- JP 2001191475 A 20010717 - THINK LABS KK
- JP 2001260304 A 20010925 - THINK LABS KK
- JP 2002127369 A 20020508 - THINK LABS KK
Citation (search report)
- [A] EP 1449649 A2 20040825 - THINK LABS KK [JP]
- [A] EP 0882817 A2 19981209 - METZGER HUBERT F [US]
- [A] US 4294673 A 19811013 - KIMOTO YASUO, et al
- [A] DE 2415705 A1 19751016 - ESSER HERBERT
- [A] PATENT ABSTRACTS OF JAPAN vol. 017, no. 312 (M - 1429) 15 June 1993 (1993-06-15)
Designated contracting state (EPC)
CH DE FR GB IT LI
DOCDB simple family (publication)
EP 1642713 A1 20060405; EP 1642713 B1 20081029; DE 602004017469 D1 20081211
DOCDB simple family (application)
EP 04023213 A 20040929; DE 602004017469 T 20040929