EP 1644777 A2 20060412 - RESIST COMPOSITION
Title (en)
RESIST COMPOSITION
Title (de)
RESISTZUSAMMENSETZUNG
Title (fr)
COMPOSITION DE MATIERE DE RESERVE
Publication
Application
Priority
- JP 2004009980 W 20040706
- JP 2003193831 A 20030708
- US 48949303 P 20030724
Abstract (en)
[origin: WO2005003859A2] There is provided a resist composition used for the production of printed boards, which comprises (A) a resin component, (B) a photopolymerization initiator, (C) water and (D) an organic solvent, wherein the organic solvent (D) contains: (D-1) at least one organic solvent selected from the group consisting of an (-hydroxycarboxylate ester, a (-alkoxycarboxylate ester, a 1,3-diol compound and a 1,3-diol compound derivative, and (D-2) an organic solvent having a hydroxyl group other than (D-1).
IPC 1-7
IPC 8 full level
G03F 7/00 (2006.01); G03F 7/004 (2006.01); G03F 7/027 (2006.01); G03F 7/033 (2006.01)
CPC (source: EP)
G03F 7/0048 (2013.01); G03F 7/027 (2013.01); G03F 7/033 (2013.01)
Citation (search report)
See references of WO 2005003859A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005003859 A2 20050113; WO 2005003859 A3 20050414; EP 1644777 A2 20060412
DOCDB simple family (application)
JP 2004009980 W 20040706; EP 04747446 A 20040706