EP 1646469 A1 20060419 - CORRUGATED STRUCTURES AND METHOD FOR THERMOFORMING PACKAGES
Title (en)
CORRUGATED STRUCTURES AND METHOD FOR THERMOFORMING PACKAGES
Title (de)
WELLPAPPE-BÖGEN UND VERFAHREN ZUM THERMOFORMEN VON VERPACKUNGEN
Title (fr)
STRUCTURES ONDULEES ET PROCEDE POUR THERMOFORMER DES EMBALLAGES
Publication
Application
Priority
- US 2004023285 W 20040721
- US 48943303 P 20030723
Abstract (en)
[origin: WO2005009658A1] A corrugated structure (100) having a first flat layer (10), a first corrugated layer (20) secured to the first flat layer (10), a second flat layer (30) having a first side (31) and a second side (32), wherein the first side (31) is secured to the first corrugated layer (20) on a side opposite of the first flat layer, a coating layer (40) secured to the second side (32) of the second flat layer (30), wherein the coating layer (40) has a melting temperature of at least about 450 degrees Fahrenheit and chloroform-soluble extractives of at most about 0.5 milligrams per square inch.
IPC 1-7
IPC 8 full level
B32B 3/28 (2006.01); B32B 29/06 (2006.01); B65H 54/46 (2006.01)
CPC (source: EP US)
B32B 3/28 (2013.01 - EP US); B32B 27/06 (2013.01 - US); B32B 27/12 (2013.01 - US); B32B 27/32 (2013.01 - US); B32B 27/36 (2013.01 - US); B32B 29/06 (2013.01 - EP US); B32B 2307/738 (2013.01 - US); B32B 2323/00 (2013.01 - US); B32B 2367/00 (2013.01 - US); B32B 2439/70 (2013.01 - US); Y10T 428/24694 (2015.01 - EP US)
Citation (search report)
See references of WO 2005009658A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005009658 A1 20050203; EP 1646469 A1 20060419; US 2005031834 A1 20050210
DOCDB simple family (application)
US 2004023285 W 20040721; EP 04757147 A 20040721; US 89457504 A 20040720