EP 1647173 A2 20060419 - PACKAGING OF SEMICONDUCTOR DEVICES FOR INCREASED RELIABILITY
Title (en)
PACKAGING OF SEMICONDUCTOR DEVICES FOR INCREASED RELIABILITY
Title (de)
KAPSELUNG VON HALBLEITERBAUELEMENTEN FÜR VERBESSERTE ZUVERLÄSSIGKEIT
Title (fr)
ENCAPSULATION DE DISPOSITIFS A SEMI-CONDUCTEURS POUR AMELIORATION DE LA FIABILITE
Publication
Application
Priority
- US 2004022344 W 20040712
- US 62184403 A 20030716
Abstract (en)
[origin: US2005011656A1] A high reliability radiation shielding integrated circuit device comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greater than the total dose tolerance of the circuit die. An integrated circuit device for use in high reliability applications. The integrated circuit device is designed to be highly reliable and protect integrated circuit die from failing or becoming unreliable due to radiation, mechanical forces, thermal exposure, or chemical contaminates.
IPC 1-7
IPC 8 full level
H01L 23/552 (2006.01); H01L 25/10 (2006.01)
CPC (source: EP KR US)
H01L 23/12 (2013.01 - KR); H01L 23/36 (2013.01 - EP US); H01L 23/3677 (2013.01 - EP US); H01L 23/552 (2013.01 - EP US); H01L 23/556 (2013.01 - EP); H01L 25/105 (2013.01 - EP US); H05K 9/00 (2013.01 - KR); H01L 23/10 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 25/0655 (2013.01 - EP US); H01L 2224/32188 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2225/1058 (2013.01 - EP US); H01L 2225/1094 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01077 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/16195 (2013.01 - EP US); H01L 2924/1627 (2013.01 - EP US); H01L 2924/19107 (2013.01 - EP US); H01L 2924/3011 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US); H01L 2924/3511 (2013.01 - EP US); Y10T 29/49128 (2015.01 - EP US); Y10T 29/4913 (2015.01 - EP US); Y10T 29/49142 (2015.01 - EP US); Y10T 29/49144 (2015.01 - EP US); Y10T 29/49149 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2005011656 A1 20050120; US 7191516 B2 20070320; CN 101345238 A 20090114; CN 101345238 B 20101215; CN 1823561 A 20060823; CN 1823561 B 20110907; EP 1647173 A2 20060419; EP 1647173 A4 20171227; HK 1127162 A1 20090918; JP 2007531981 A 20071108; JP 4795948 B2 20111019; KR 101059918 B1 20110829; KR 20060113632 A 20061102; US 2008251895 A1 20081016; US 2010155912 A1 20100624; US 7696610 B2 20100413; US 8018739 B2 20110913; WO 2005010937 A2 20050203; WO 2005010937 A3 20050526
DOCDB simple family (application)
US 62184403 A 20030716; CN 200480020214 A 20040712; CN 200810210299 A 20040712; EP 04778051 A 20040712; HK 09106262 A 20090713; JP 2006520255 A 20040712; KR 20067000831 A 20040712; US 2004022344 W 20040712; US 55914006 A 20061113; US 71912310 A 20100308