Global Patent Index - EP 1647610 A3

EP 1647610 A3 20060823 - Thermal spraying powder, thermal spraying method and method for forming thermal spray coating

Title (en)

Thermal spraying powder, thermal spraying method and method for forming thermal spray coating

Title (de)

Thermisches Sprühpulver, thermisches Sprühverfahren und Verfahren zum Herstellen einer Beschichtung mittels einem thermischen Spritzverfahren.

Title (fr)

Poudre pour pulvérisation thermique, méthode de pulvérisation thermique et méthode de fabrication d'un revêtement pour pulvérisation thermique.

Publication

EP 1647610 A3 20060823 (EN)

Application

EP 05256344 A 20051012

Priority

JP 2004300874 A 20041015

Abstract (en)

[origin: EP1647610A2] A thermal spraying powder contains a chromium-iron based alloy powder that includes carbon. The ratio of the mass of carbon in the alloy powder to the total mass of chromium and iron in the alloy powder is 2% or more. 10% particle size D 10 of the alloy powder is preferably 10 µm or more, and more preferably 15 µm or more. 50% particle size D 50 of the alloy powder is preferably 20 µm or more. The thermal spraying powder is suitable for use in forming a thermal spray coating through high-velocity flame spraying.

IPC 8 full level

C23C 4/04 (2006.01); C23C 4/06 (2016.01)

CPC (source: EP KR US)

C23C 4/04 (2013.01 - EP KR US); C23C 4/06 (2013.01 - KR); C23C 4/067 (2016.01 - EP US)

Citation (search report)

  • [A] EP 0608468 A1 19940803 - LINDE AG [DE]
  • [X] PATENT ABSTRACTS OF JAPAN vol. 006, no. 227 (C - 134) 12 November 1982 (1982-11-12)
  • [XA] PATENT ABSTRACTS OF JAPAN vol. 010, no. 230 (C - 365) 9 August 1986 (1986-08-09)
  • [X] PATENT ABSTRACTS OF JAPAN vol. 010, no. 139 (C - 348) 22 May 1986 (1986-05-22)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 1647610 A2 20060419; EP 1647610 A3 20060823; CN 1760409 A 20060419; JP 2006111929 A 20060427; KR 20060053252 A 20060519; US 2006081090 A1 20060420

DOCDB simple family (application)

EP 05256344 A 20051012; CN 200510113456 A 20051014; JP 2004300874 A 20041015; KR 20050096486 A 20051013; US 25010405 A 20051013