EP 1647999 A1 20060419 - A mounting assembly for inductors and method of producing the same
Title (en)
A mounting assembly for inductors and method of producing the same
Title (de)
Zusammenbau für Induktoren und Verfahren zur Herstellung
Title (fr)
Ensemble de montage pour les inductances et son procédé de fabrication
Publication
Application
Priority
EP 04425772 A 20041013
Abstract (en)
A mounting assembly of an inductor (1) includes: a moulded inductor body (bobbin - 2) of an electrically insulating material having an end face (20b) with one or more integrally moulded pins (200) protruding from the end face (20b), a wire winding (3) around the body (2), the wire of the winding having at least one end (30) wound around the a respective one of the integrally moulded pins (200) protruding therefrom, and a mass of soldering material (4) securing the end(s) of the wire (3) wound around the respective integrally moulded pin (200), whereby the soldering material (4) provides electrical contact to the end (30) of the wire.
IPC 8 full level
H01F 5/04 (2006.01); H01F 27/32 (2006.01); H01F 41/06 (2006.01)
CPC (source: EP)
H01F 5/04 (2013.01); H01F 41/076 (2016.01); H01F 2005/043 (2013.01); H01F 2027/297 (2013.01)
Citation (search report)
- [X] US 4774756 A 19881004 - DETHIENNE HENRI-PIERRE Y [BE]
- [X] US 5696477 A 19971209 - YAMAMORI MASAYA [JP], et al
- [A] WO 03069640 A1 20030821 - SIEMENS AG OESTERREICH [AT], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1647999 A1 20060419; EP 1647999 B1 20080319; AT E389942 T1 20080415; CN 1760999 A 20060419; CN 1760999 B 20110112; DE 602004012566 D1 20080430; DE 602004012566 T2 20090416
DOCDB simple family (application)
EP 04425772 A 20041013; AT 04425772 T 20041013; CN 200510113578 A 20051013; DE 602004012566 T 20041013