EP 1648242 A1 20060426 - EMULSIONS
Title (en)
EMULSIONS
Title (de)
EMULSIONEN
Title (fr)
EMULSIONS
Publication
Application
Priority
- US 0323358 W 20030724
- US 39834502 P 20020724
- US 26828402 A 20021009
Abstract (en)
[origin: US2004016636A1] Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell further includes an anode positioned in a lower portion of the fluid basin, the anode having a plurality of parallel channels formed therethrough, and a base member configured to receive the anode, the base member having a plurality of groves formed into an anode receiving surface, each of the plurality of grooves terminating into an annular drain channel. A membrane support assembly configured to position a membrane immediately above the anode in a substantially planar orientation with respect to the anode surface is provided, the membrane support assembly having a plurality of channels and bores formed therein.
IPC 1-7
IPC 8 full level
A23D 7/00 (2006.01); A23D 7/005 (2006.01); A23D 7/01 (2006.01); A23J 7/00 (2006.01); C07F 9/10 (2006.01); C25D 7/12 (2006.01); H01L 21/288 (2006.01); C25B 9/19 (2021.01)
CPC (source: EP KR US)
A23D 7/00 (2013.01 - EP US); A23D 7/005 (2013.01 - EP US); A23D 7/01 (2013.01 - EP US); A23J 7/00 (2013.01 - EP US); C07F 9/103 (2013.01 - EP US); C25D 7/12 (2013.01 - KR); C25D 17/00 (2013.01 - KR); C25D 17/001 (2013.01 - EP KR US); C25D 17/10 (2013.01 - KR); H01L 21/28 (2013.01 - KR); H01L 21/2885 (2013.01 - EP KR US); C25D 7/123 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2004016636 A1 20040129; US 7247222 B2 20070724; CN 1678770 A 20051005; EP 1648242 A1 20060426; EP 1648242 A4 20060927; KR 20050025990 A 20050314; KR 20060058152 A 20060529; TW 200409177 A 20040601; TW 200710276 A 20070316; TW I315084 B 20090921; TW I345801 B 20110721; US 2006237307 A1 20061026; WO 2004009878 A2 20040129; WO 2004009878 A3 20050324; WO 2005016017 A1 20050224
DOCDB simple family (application)
US 26828402 A 20021009; CN 03820055 A 20030724; EP 03818181 A 20030724; KR 20057001277 A 20050124; KR 20067009315 A 20060512; TW 92120121 A 20030723; TW 95116936 A 20030723; US 0323356 W 20030724; US 0323358 W 20030724; US 47329506 A 20060622