EP 1648974 A4 20080423 - SLURRIES AND METHODS FOR CHEMICAL-MECHANICAL PLANARIZATION OF COPPER
Title (en)
SLURRIES AND METHODS FOR CHEMICAL-MECHANICAL PLANARIZATION OF COPPER
Title (de)
AUFSCHLÄMMUNGEN UND VERFAHREN ZUR CHEMISCH-MECHANISCHEN PLANARISIERUNG VON KUPFER
Title (fr)
SUSPENSIONS AQUEUSES ET PROCEDES POUR LA PLANARISATION CHIMICO-MECANIQUE DU CUIVRE
Publication
Application
Priority
- US 2004024143 W 20040727
- US 63169803 A 20030730
- US 84671804 A 20040513
Abstract (en)
[origin: WO2005012451A2] The claimed invention involves a novel aqueous slurry for chemical-mechanical planarization that is effective for polishing copper at high polish rates. The aqueous slurry according to the present invention comprises particles of MoO2 or MoO3 and an oxidizing agent. A method for polishing copper by chemical-mechanical planarization includes contacting copper with a polishing pad and an aqueous slurry comprising particles Of MoO2 or MoO3 and an oxidizing agent.
IPC 8 full level
C09G 1/02 (2006.01); B24B 1/00 (2006.01); C01G 39/02 (2006.01); C09G 1/04 (2006.01); C09K 3/14 (2006.01); C23F 3/04 (2006.01); C23F 3/06 (2006.01); H01L 21/321 (2006.01)
CPC (source: EP KR)
C09G 1/02 (2013.01 - EP); C09K 3/1409 (2013.01 - EP); C09K 3/1463 (2013.01 - EP); C23F 3/06 (2013.01 - EP); H01L 21/304 (2013.01 - KR); H01L 21/3212 (2013.01 - EP)
Citation (search report)
- [XY] US 6551172 B1 20030422 - NYUI MASARU [JP], et al
- [Y] WO 0132799 A1 20010510 - NANOGRAM CORP [US]
- [Y] EP 1167482 A2 20020102 - TOSHIBA KK [JP], et al
- [A] ABCR GMBH&CO ET AL: "AVOCADO/ABCR Catalogue 2000-2001 : Chemicals for Research and Development", AVOCADO/ABCR CATALOGUE, XX, XX, 2001, pages 774, XP002337567
- See references of WO 2005012451A2
Citation (examination)
- FAYOLLE M ET AL: "Copper CMP evaluation: planarization issues", MICROELECTRONIC ENGINEERING, ELSEVIER PUBLISHERS BV., AMSTERDAM, NL, vol. 37-38, 1 November 1997 (1997-11-01), pages 135 - 141, XP004103556, ISSN: 0167-9317, DOI: 10.1016/S0167-9317(97)00104-4
- LEE E H ET AL: "The oxidative-dissolution behaviors of fission products in a Na2CO3â H2O2 solution", JOURNAL OF RADIOANALYTICAL AND NUCLEAR CHEMISTRY, KLUWER ACADEMIC PUBLISHERS, DO, vol. 281, no. 3, 2 July 2009 (2009-07-02), pages 339 - 346, XP019751193, ISSN: 1588-2780, DOI: 10.1007/S10967-009-0018-6
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL HR LT LV MK
DOCDB simple family (publication)
WO 2005012451 A2 20050210; WO 2005012451 A3 20060518; EP 1648974 A2 20060426; EP 1648974 A4 20080423; JP 2007500943 A 20070118; KR 20060118396 A 20061123
DOCDB simple family (application)
US 2004024143 W 20040727; EP 04779276 A 20040727; JP 2006521994 A 20040727; KR 20067000223 A 20060104