EP 1650798 A3 20090311 - A substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same
Title (en)
A substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same
Title (de)
Substrat mit eingebautem Chip und externe Anschlusskontakte auf beiden Seiten und Herstellungsverfahren dafür
Title (fr)
Substrat avec puce incorporée et avec des bornes de connexion des deux côtés et sa méthode de fabrication
Publication
Application
Priority
JP 2004308558 A 20041022
Abstract (en)
[origin: EP1650798A2] A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90 % by weight of spherical filler.
IPC 8 full level
H01L 23/29 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP US)
H01L 21/568 (2013.01 - EP US); H01L 23/29 (2013.01 - EP US); H01L 23/293 (2013.01 - EP US); H01L 23/31 (2013.01 - EP US); H01L 23/3128 (2013.01 - EP US); H01L 23/5389 (2013.01 - EP US); H01L 24/19 (2013.01 - EP US); H01L 24/20 (2013.01 - EP US); H01L 24/24 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H01L 2224/04105 (2013.01 - EP US); H01L 2224/12105 (2013.01 - EP US); H01L 2224/20 (2013.01 - EP US); H01L 2224/211 (2013.01 - EP US); H01L 2224/24226 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/73267 (2013.01 - EP US); H01L 2224/82001 (2013.01 - EP); H01L 2224/83191 (2013.01 - EP US); H01L 2224/92244 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/0103 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/18162 (2013.01 - EP US); H01L 2924/3511 (2013.01 - EP US)
Citation (search report)
- [XY] US 2004160752 A1 20040819 - YAMASHITA YOSHIHISA [JP], et al
- [XA] WO 02101812 A1 20021219 - INTEL CORP [US]
- [Y] US 5656250 A 19970812 - TANAKA YUKO [JP], et al
- [Y] US 3965277 A 19760622 - GUDITZ ELIS A, et al
- [A] US 2002117743 A1 20020829 - NAKATANI SEIICHI [JP], et al
- [A] US 2003087538 A1 20030508 - UENO YUKIHIRO [JP]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK YU
DOCDB simple family (publication)
EP 1650798 A2 20060426; EP 1650798 A3 20090311; CN 100446225 C 20081224; CN 1819160 A 20060816; JP 2006120943 A 20060511; KR 20060051422 A 20060519; TW 200614900 A 20060501; US 2006087045 A1 20060427; US 7312536 B2 20071225
DOCDB simple family (application)
EP 05255576 A 20050912; CN 200510131558 A 20050921; JP 2004308558 A 20041022; KR 20050087299 A 20050920; TW 94131451 A 20050913; US 22482105 A 20050913