Global Patent Index - EP 1652211 A2

EP 1652211 A2 20060503 - ELECTRODE SYSTEM PROVIDED WITH A NOVEL CONNECTION, ASSOCIATED LAMP COMPRISING SAID FILM AND METHOD FOR THE PRODUCTION OF SAID CONNECTION

Title (en)

ELECTRODE SYSTEM PROVIDED WITH A NOVEL CONNECTION, ASSOCIATED LAMP COMPRISING SAID FILM AND METHOD FOR THE PRODUCTION OF SAID CONNECTION

Title (de)

ELEKTRODENSYSTEM MIT NEUARTIGER STIFT-FOLIEN-VERBINDUNG, ZUGEHÖRIGE LAMPE MIT DIESER VERBINDUNG UND VERFAHREN ZUR HERSTELLUNG DER VERBINDUNG

Title (fr)

SYSTEME D'ELECTRODE POURVU D'UN NOUVEAU TYPE DE LIAISON, LAMPE ASSOCIEE COMPRENANT UN TEL SYSTEME ET PROCEDE DE PRODUCTION DE LADITE LIAISON

Publication

EP 1652211 A2 20060503 (DE)

Application

EP 04762412 A 20040719

Priority

  • DE 2004001561 W 20040719
  • DE 10336087 A 20030806

Abstract (en)

[origin: WO2005015600A2] The invention relates to an electrode system for the construction of a lamp. Said system comprises a Mo-film (4) which is connected to a pin-shaped associated piece (2), and the film (4) and/or the pin-shaped associated piece (2) is coated with ruthenium (5, 8). The pin is flattened (3) at the end. A point-shaped fusion welding connection (6) is produced during a contactless welding step, said connection being surrounded by an annular-shaped high temperature solder (7). Said type of connection is not brittle.

IPC 1-7

H01J 61/36

IPC 8 full level

H01J 5/38 (2006.01); H01J 9/28 (2006.01); H01J 9/32 (2006.01); H01J 61/36 (2006.01); H01K 1/38 (2006.01); H01K 1/40 (2006.01)

CPC (source: EP US)

H01J 9/28 (2013.01 - EP US); H01J 9/326 (2013.01 - EP US); H01J 61/368 (2013.01 - EP US); H01K 1/40 (2013.01 - EP US)

Citation (search report)

See references of WO 2005015600A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2005015600 A2 20050217; WO 2005015600 A3 20050811; CA 2534860 A1 20050217; DE 10336087 A1 20050303; EP 1652211 A2 20060503; JP 2007501493 A 20070125; US 2006208640 A1 20060921

DOCDB simple family (application)

DE 2004001561 W 20040719; CA 2534860 A 20040719; DE 10336087 A 20030806; EP 04762412 A 20040719; JP 2006522215 A 20040719; US 56671504 A 20040719