EP 1652410 A1 20060503 - USE OF A LAYER CONSISTING OF HYDROPHOBIC, LINEAR OR TWO-DIMENSIONAL POLYCYCLIC AROMATICS AS A BARRIER LAYER OR AN ENCAPSULATION AND ELECTRIC COMPONENTS CONSTRUCTED WITH A LAYER OF THIS TYPE AND COMPRISING ORGANIC POLYMERS
Title (en)
USE OF A LAYER CONSISTING OF HYDROPHOBIC, LINEAR OR TWO-DIMENSIONAL POLYCYCLIC AROMATICS AS A BARRIER LAYER OR AN ENCAPSULATION AND ELECTRIC COMPONENTS CONSTRUCTED WITH A LAYER OF THIS TYPE AND COMPRISING ORGANIC POLYMERS
Title (de)
VERWENDUNG EINER SCHICHT AUS HYDROPHOBEN, LINEAR ODER ZWEIDIMENSIONAL POLYZYKLISCHEN AROMATEN ALS SPERRSCHICHT ODER KAPSELUNG UND MIT EINER DERARTIGEN SCHICHT AUFGEBAUTE ELEKTRISCHE BAUELEMENTE MIT ORGANISCHEN POLYMEREN
Title (fr)
UTILISATION D'UNE COUCHE FORMEE D'AROMATES HYDROPHOBES, POLYCYCLIQUES LINEAIRES OU BIDIMENSIONNELS, COMME COUCHE D'ARRET OU DE BLINDAGE, ET COMPOSANTS ELECTRIQUES DOTES D'UNE COUCHE DE CE TYPE ET DE POLYMERES ORGANIQUES
Publication
Application
Priority
- DE 2004001775 W 20040804
- DE 10336531 A 20030805
- DE 10339629 A 20030828
Abstract (en)
[origin: WO2005015959A1] The invention relates to an electric component constructed with organic layers and comprising a layer consisting of a hydrophobic, linear or two-dimensional polycyclic aromatic with between 3 and 12 ring structures, including phthalocyanines containing metal or devoid of metal, which have -H and/or -F, alkyl groups, aryl groups and/or fluorinated hydrocarbons as residual groups, said layer being used as a barrier layer or an encapsulation. This permits in particular hybrid constructions consisting of SM layers and polymer layers to be obtained. In addition, a retroactive encapsulation of the component is no longer required.
IPC 1-7
IPC 8 full level
C09K 11/06 (2006.01); H05B 33/14 (2006.01); H01L 51/00 (2006.01); H01L 51/50 (2006.01); H01L 51/52 (2006.01)
CPC (source: EP KR US)
C07D 487/22 (2013.01 - KR); C09K 11/06 (2013.01 - EP KR US); H05B 33/14 (2013.01 - EP KR US); C09K 2211/1022 (2013.01 - EP US); C09K 2211/1029 (2013.01 - EP US); C09K 2211/187 (2013.01 - EP US); C09K 2211/188 (2013.01 - EP US); H10K 50/17 (2023.02 - US); H10K 50/171 (2023.02 - EP KR); H10K 50/844 (2023.02 - EP KR US); H10K 85/311 (2023.02 - EP US); H10K 85/615 (2023.02 - EP US); H10K 2102/3031 (2023.02 - EP US); Y10T 428/31504 (2015.04 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005015959 A1 20050217; EP 1652410 A1 20060503; JP 2007501510 A 20070125; KR 20060113884 A 20061103; US 2007166547 A1 20070719
DOCDB simple family (application)
DE 2004001775 W 20040804; EP 04762620 A 20040804; JP 2006522229 A 20040804; KR 20067002535 A 20060206; US 56711204 A 20040804