Global Patent Index - EP 1654757 A2

EP 1654757 A2 20060510 - STRESSED SEMICONDUCTOR-ON-INSULATOR STRUCTURE RESISTANT TO HIGH-TEMPERATURE STRESS

Title (en)

STRESSED SEMICONDUCTOR-ON-INSULATOR STRUCTURE RESISTANT TO HIGH-TEMPERATURE STRESS

Title (de)

GEGENÜBER HOCHTEMPERATURBELASTUNG BESTÄNDIGE GESPANNTE HALBLEITER-AUF-ISOLATOR-STRUKTUR

Title (fr)

STRUCTURE SEMICONDUCTEUR-SUR-ISOLANT CONTRAINTE AYANT UNE TENUE DES CONTRAINTES AUX HAUTES TEMPERATURES

Publication

EP 1654757 A2 20060510 (FR)

Application

EP 04767800 A 20040728

Priority

  • FR 2004002018 W 20040728
  • FR 0309377 A 20030730

Abstract (en)

[origin: US2005023610A1] A semiconductor-on-insulator structure for electronics, optics or optoelectronics, in which a semiconductor layer includes desirable elastic constraints. The structure includes a substrate, an insulating layer on the substrate, and a semiconductor layer on the insulating layer. The semiconductor layer has elastic constraints, and the insulating layer is made of an electrically insulating material having a viscosity temperature TG that is sufficiently high so as to protect the semiconductor layer from loss of the elastic constraints when the structure is exposed to a temperature of about 950° C. or more. Also described is a process for producing such a semiconductor-on-insulator structure.

IPC 1-7

H01L 21/762

IPC 8 full level

H01L 21/762 (2006.01)

CPC (source: EP)

H01L 21/76251 (2013.01)

Citation (search report)

See references of WO 2005013317A3

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

FR 2858460 A1 20050204; FR 2858460 B1 20051014; CN 1830078 A 20060906; EP 1654757 A2 20060510; JP 2007500434 A 20070111; KR 20060056955 A 20060525; US 2005023610 A1 20050203; WO 2005013317 A2 20050210; WO 2005013317 A3 20050331

DOCDB simple family (application)

FR 0309377 A 20030730; CN 200480021742 A 20040728; EP 04767800 A 20040728; FR 2004002018 W 20040728; JP 2006521618 A 20040728; KR 20067001759 A 20060125; US 70089603 A 20031103