EP 1656473 A2 20060517 - METAL NANO-OBJECTS, FORMED ON SEMICONDUCTOR SURFACES, AND METHODS FOR MAKING SAID NANO-OBJECTS
Title (en)
METAL NANO-OBJECTS, FORMED ON SEMICONDUCTOR SURFACES, AND METHODS FOR MAKING SAID NANO-OBJECTS
Title (de)
AUF OBERFLÄCHE VON HALBLEITERN HERGESTELLTE METALLISCHE NANO-OBJEKTE, UND DEREN HERSTELLUNGSVERFAHREN
Title (fr)
NANO-OBJETS METALLIQUES, FORMES SUR DES SURFACES DE SEMICONDUCTEURS, ET PROCEDE DE FABRICATION DE CES NANO-OBJETS
Publication
Application
Priority
- FR 0302093 W 20030704
- FR 0208457 A 20020705
Abstract (en)
[origin: WO2004005593A2] The invention concerns metal nano-objects, formed on semiconductor surfaces, and a method for making said nano-objects. The invention is applicable in nanoelectronics for example to obtain nano-objects (4) by deposition of a metal on a prepared cubic SiC surface (2).
IPC 1-7
IPC 8 full level
B82B 1/00 (2006.01); B82B 3/00 (2006.01); C23C 14/04 (2006.01); C30B 23/00 (2006.01); C30B 33/00 (2006.01); H01L 21/04 (2006.01); H01L 29/04 (2006.01); H01L 29/06 (2006.01); H01L 29/15 (2006.01); H01L 29/24 (2006.01)
CPC (source: EP US)
B82Y 10/00 (2013.01 - EP US); B82Y 30/00 (2013.01 - EP US); C23C 14/04 (2013.01 - EP US); C30B 23/00 (2013.01 - EP US); C30B 29/02 (2013.01 - EP US); C30B 29/605 (2013.01 - EP US); C30B 33/00 (2013.01 - EP US); H01L 21/0445 (2013.01 - EP US); H01L 29/045 (2013.01 - EP US); H01L 29/1608 (2013.01 - EP US)
Citation (search report)
See references of WO 2004005593A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2841892 A1 20040109; FR 2841892 B1 20050506; AU 2003260663 A1 20040123; AU 2003260663 A8 20040123; CA 2491514 A1 20040115; EP 1656473 A2 20060517; EP 2233615 A2 20100929; EP 2233615 A3 20101006; JP 2005532180 A 20051027; US 2005211970 A1 20050929; WO 2004005593 A2 20040115; WO 2004005593 A3 20040408
DOCDB simple family (application)
FR 0208457 A 20020705; AU 2003260663 A 20030704; CA 2491514 A 20030704; EP 03762740 A 20030704; EP 10169399 A 20030704; FR 0302093 W 20030704; JP 2004518880 A 20030704; US 52064705 A 20050105