Global Patent Index - EP 1658033 B1

EP 1658033 B1 20120530 - Blister pack system which assures a reliable contact making when an item is removed

Title (en)

Blister pack system which assures a reliable contact making when an item is removed

Title (de)

Blisterpackungsanordnung mit störungsfreier Kontaktgabe bei der Entnahme

Title (fr)

Système d'emballage sous blister sans risque de contact accidentel lors du prélèvement du contenu

Publication

EP 1658033 B1 20120530 (DE)

Application

EP 04738665 A 20040615

Priority

  • DE 2004001213 W 20040615
  • DE 10327022 A 20030616

Abstract (en)

[origin: DE10327022B3] Blister package comprises a pressing device (40) having a contact element (24) on the head part (25) and a further contact element (30) on the pin part (27). The contact elements are electrically connected to each other. The individual contact surfaces and the assigned individual conductor strips in insulated surface of an upper part (4). Preferred Features: At least one of the individual strip conductors and a common strip conductor are partially covered by an electrically insulating layer. The package has a receiving region for a housing of a control and computation unit and an interface to the contact points.

IPC 8 full level

A61J 7/04 (2006.01); A61J 1/03 (2006.01)

CPC (source: EP US)

A61J 7/0481 (2013.01 - EP US); A61J 1/035 (2013.01 - EP US); A61J 2200/30 (2013.01 - EP US); Y10T 74/20534 (2015.01 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

DE 10327022 B3 20041014; EP 1658033 A1 20060524; EP 1658033 B1 20120530; US 2007095715 A1 20070503; US 7878367 B2 20110201; WO 2004112686 A1 20041229

DOCDB simple family (application)

DE 10327022 A 20030616; DE 2004001213 W 20040615; EP 04738665 A 20040615; US 55984204 A 20040615