EP 1658582 A1 20060524 - METHOD FOR PRODUCING BRIDGE MODULES
Title (en)
METHOD FOR PRODUCING BRIDGE MODULES
Title (de)
VERFAHREN ZUR HERSTELLUNG VON MODULBRÜCKEN
Title (fr)
PROCEDE DE PRODUCTION DE PONTS DE MODULE
Publication
Application
Priority
- EP 2004009421 W 20040824
- DE 10339547 A 20030826
- DE 10358422 A 20031213
Abstract (en)
[origin: WO2005022456A1] The invention relates to a method for producing bridge modules (29) for smart labels, enabling the positioning of chip modules (25) on carriers (31) and the bridged conductive connection of connection elements of said chip module (25) to connection elements (30a, 30b) of antenna elements (30) that are located on or in the carriers (31). Said method comprises the following steps: formation (2) of recesses (22) located one behind the other in a continuous carrier strip (21) that can be displaced in a longitudinal direction; positioning (4) of a respective chip module (25) in each recess (22) with the connection elements facing upwards; and application (8) of contact layer strips (27a, 27b) to the connection elements of the chip modules (25) and to a surface of the carrier strip (21) that lies adjacent to the recesses (22) in order to form enlarged contact surfaces.
IPC 1-7
IPC 8 full level
G06K 19/077 (2006.01)
CPC (source: EP US)
G06K 19/07718 (2013.01 - EP US); G06K 19/07745 (2013.01 - EP US); G06K 19/07749 (2013.01 - EP US); G06K 19/07752 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Citation (search report)
See references of WO 2005022456A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005022456 A1 20050310; EP 1658582 A1 20060524; JP 2007503635 A 20070222; US 2006261957 A1 20061123
DOCDB simple family (application)
EP 2004009421 W 20040824; EP 04764401 A 20040824; JP 2006524315 A 20040824; US 56975906 A 20060224