EP 1658644 A2 20060524 - THIN-LAYER LIGHT-EMITTING DIODE CHIP AND METHOD FOR THE PRODUCTION THEREOF
Title (en)
THIN-LAYER LIGHT-EMITTING DIODE CHIP AND METHOD FOR THE PRODUCTION THEREOF
Title (de)
DÜNNSCHICHT-LEUCHTDIODENCHIP UND VERFAHREN ZU SEINER HERSTELLUNG
Title (fr)
PUCE DE DIODE ELECTROLUMINESCENTE A MINCE COUCHE ET SON PROCEDE DE PRODUCTION
Publication
Application
Priority
- DE 2004001854 W 20040819
- DE 10340271 A 20030829
Abstract (en)
[origin: WO2005024962A2] A thin-layer light-emitting diode chip (5) comprising a sequence of epitaxial layers (6) which are arranged on a carrier element (2) and which are provided with an active area (8) producing electromagnetic radiation, in addition to a reflecting layer (3) which is arranged on a main surface of the sequence of epitaxial layers (6) oriented towards the carrier element (2) and which reflects at least one part of the electromagnetic radiation produced in the sequence of epitaxial layer (6) back to said layer, wherein a structured layer (1) is arranged on a radiation decoupling surface (7) of the epitaxial layer facing away from the carrier element (2), said structured layer containing glass material and being provided with structuring which comprises projections (5) which are tapered in the direction of the radiation decoupling surface (7) and which have a lateral grid size which is smaller than the wavelength of electromagnetic radiation emitted from the sequence of epitaxial layers (6). The structured layer (1) is advantageously applied as spin-on glass and is structured by grey tone lithography.
IPC 1-7
IPC 8 full level
H01L 33/44 (2010.01); H01L 33/22 (2010.01); H01L 33/40 (2010.01)
CPC (source: EP US)
H01L 33/44 (2013.01 - EP US); H01L 33/22 (2013.01 - EP US); H01L 33/405 (2013.01 - EP US); H01L 2933/0083 (2013.01 - EP US); H01L 2933/0091 (2013.01 - EP US)
Citation (search report)
See references of WO 2005024962A2
Citation (examination)
JP H07162037 A 19950623 - TOSHIBA CORP
Designated contracting state (EPC)
DE
DOCDB simple family (publication)
WO 2005024962 A2 20050317; WO 2005024962 A3 20050616; CN 1846316 A 20061011; DE 10340271 A1 20050414; DE 10340271 B4 20190117; EP 1658644 A2 20060524; JP 2007504640 A 20070301; KR 20060135599 A 20061229; TW 200511616 A 20050316; TW I243491 B 20051111; US 2006237734 A1 20061026
DOCDB simple family (application)
DE 2004001854 W 20040819; CN 200480024845 A 20040819; DE 10340271 A 20030829; EP 04762694 A 20040819; JP 2006524216 A 20040819; KR 20067003984 A 20060227; TW 93125701 A 20040827; US 56793504 A 20040819