Global Patent Index - EP 1660572 A1

EP 1660572 A1 20060531 - ADHESIVES HAVING IMPROVED CHEMICAL RESISTANCE AND CURABLE SILICONE COMPOSITIONS FOR PREPARING THE ADHESIVES

Title (en)

ADHESIVES HAVING IMPROVED CHEMICAL RESISTANCE AND CURABLE SILICONE COMPOSITIONS FOR PREPARING THE ADHESIVES

Title (de)

KLEBSTOFFE MIT VERBESSERTER CHEMIKALIENBESTÄNDIGKEIT UND HÄRTBARE SILIKONZUSAMMENSETZUNGEN ZUR HERSTELLUNG DER KLEBSTOFFE

Title (fr)

ADHESIFS AYANT UNE RESISTANCE CHIMIQUE AMELIOREE ET COMPOSITIONS DE SILICONE DURCISSABLE POUR PREPARER LES ADHESIFS

Publication

EP 1660572 A1 20060531 (EN)

Application

EP 04777990 A 20040709

Priority

  • US 2004022241 W 20040709
  • US 64175803 A 20030814

Abstract (en)

[origin: US2005038217A1] This invention relates to a composition that can be cured to form an adhesive. The adhesive is useful in the electronics industry. The composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two terminally-unsaturated organic groups per molecule, (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, (III) a hydrosilylation catalyst, (IV) a fluoroorganosilicone having at least one functional group reactive with component (I), component (II), or both, (V) an unsaturated ester-functional compound, and (VI) an adhesion promoter. The composition may also include one or more optional components selected from (VII) a void reducing agent, (VIII) a pigment, (IX) a filler, (X) a cure modifier, (XI) a rheology modifier, and (XII) a spacer.

IPC 1-7

C08K 3/00; C08K 3/34; C08K 5/10; C08L 83/04; C09J 183/04

IPC 8 full level

C08K 5/10 (2006.01); C09J 183/04 (2006.01); C08L 83/08 (2006.01)

CPC (source: EP US)

C08K 5/10 (2013.01 - EP); C08L 83/00 (2013.01 - EP); C09J 183/04 (2013.01 - EP); C08L 83/08 (2013.01 - EP); H01L 2224/32145 (2013.01 - EP); H01L 2224/48091 (2013.01 - EP); H01L 2224/73265 (2013.01 - EP); H01L 2924/181 (2013.01 - EP); Y10T 428/31663 (2015.04 - EP US)

C-Set (source: EP)

  1. C08K 5/10 + C08L 83/04
  2. H01L 2924/181 + H01L 2924/00012
  3. H01L 2224/48091 + H01L 2924/00014
  4. C09J 183/04 + C08L 83/00

Citation (search report)

See references of WO 2005019322A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

US 2005038217 A1 20050217; US 7045586 B2 20060516; AT 386772 T 20080315; CN 100419010 C 20080917; CN 1835996 A 20060920; DE 602004011950 D1 20080403; DE 602004011950 T2 20090212; EP 1660572 A1 20060531; EP 1660572 B1 20080220; JP 2007502346 A 20070208; JP 5143423 B2 20130213; KR 101121965 B1 20120309; KR 20060064632 A 20060613; TW 200510482 A 20050316; TW I350844 B 20111021; US 2005282959 A1 20051222; US 7521125 B2 20090421; WO 2005019322 A1 20050303

DOCDB simple family (application)

US 64175803 A 20030814; AT 04777990 T 20040709; CN 200480023266 A 20040709; DE 602004011950 T 20040709; EP 04777990 A 20040709; JP 2006523189 A 20040709; KR 20067003118 A 20060214; TW 93122755 A 20040729; US 18130105 A 20050714; US 2004022241 W 20040709