EP 1665370 A1 20060607 - INTERCONNECTION STRUCTURE WITH LOW DIELECTRIC CONSTANT
Title (en)
INTERCONNECTION STRUCTURE WITH LOW DIELECTRIC CONSTANT
Title (de)
VERBINDUNGSSTRUKTUR MIT NIEDRIGER DIELEKTRIZITÄTSKONSTANTE
Title (fr)
STRUCTURE D'INTERCONNEXION A FAIBLE CONSTANTE DIELECTRIQUE
Publication
Application
Priority
- FR 2004050435 W 20040915
- FR 0350547 A 20030916
Abstract (en)
[origin: FR2859822A1] The method involves fabricating an interconnection structure having an insulating layer (103) at the base of a dielectric material having dielectric constant, and a metallic connecting unit (110) in the layer. All or part of the dielectric material is partially removed. The material is replaced with another dielectric material (113) having dielectric constant less than or equal to the dielectric constant of the former material. An independent claim is also included for a micro-electromechanical system comprising an interconnection structure.
IPC 1-7
IPC 8 full level
H01L 21/768 (2006.01)
CPC (source: EP US)
H01L 21/76831 (2013.01 - EP US); H01L 21/7688 (2013.01 - EP US); H01L 21/76885 (2013.01 - EP US); H01L 21/76834 (2013.01 - EP US)
Citation (search report)
See references of WO 2005029577A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2859822 A1 20050318; FR 2859822 B1 20060505; EP 1665370 A1 20060607; US 2007087554 A1 20070419; US 7947594 B2 20110524; WO 2005029577 A1 20050331
DOCDB simple family (application)
FR 0350547 A 20030916; EP 04816197 A 20040915; FR 2004050435 W 20040915; US 57193604 A 20040915