Global Patent Index - EP 1666536 A1

EP 1666536 A1 20060607 - CURABLE COMPOSITION

Title (en)

CURABLE COMPOSITION

Title (de)

HÄRTBARE ZUSAMMENSETZUNG

Title (fr)

COMPOSITION DURCISSABLE

Publication

EP 1666536 A1 20060607 (EN)

Application

EP 04772390 A 20040823

Priority

  • JP 2004012434 W 20040823
  • JP 2003310122 A 20030902

Abstract (en)

Desirable properties required of curable compositions include: to have satisfactory storage stability; to give a cured product having a mat surface with almost no residual tack; to give a rubbery cured product having a low modulus and high elongation; and to give a cured product the surface of which is less apt to crack or discolor even in outdoor use. The present invention provides a curable composition which comprises: a vinyl polymer the main chain of which is a product of living radical polymerization and which contains at least one crosslinkable silyl group, and a primary and/or secondary amine having a melting point of not lower than 20°C. The curable composition of the present invention gives a cured product satisfying those properties.

IPC 1-7

C08L 101/10; C08K 5/17; C09K 3/10; C09J 201/10; F16J 15/10; F16J 15/14

IPC 8 full level

C08J 3/24 (2006.01); C08K 5/17 (2006.01); C08L 101/10 (2006.01); C09J 201/10 (2006.01); C09K 3/10 (2006.01); F16J 15/10 (2006.01); F16J 15/14 (2006.01)

CPC (source: EP US)

C08J 3/24 (2013.01 - EP US); C08J 3/246 (2013.01 - EP US); C09K 3/10 (2013.01 - EP US); F16J 15/102 (2013.01 - EP US); F16J 15/14 (2013.01 - EP US); C08J 2333/00 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 1666536 A1 20060607; EP 1666536 A4 20091209; EP 1666536 B1 20140312; CA 2537553 A1 20050317; CN 100487061 C 20090513; CN 1845971 A 20061011; JP 4959983 B2 20120627; JP WO2005023938 A1 20061102; US 2007167583 A1 20070719; WO 2005023938 A1 20050317

DOCDB simple family (application)

EP 04772390 A 20040823; CA 2537553 A 20040823; CN 200480025031 A 20040823; JP 2004012434 W 20040823; JP 2005513629 A 20040823; US 57008704 A 20040823