EP 1671525 B1 20070124 - COMPONENT MOUNTING METHOD AND APPARATUS
Title (en)
COMPONENT MOUNTING METHOD AND APPARATUS
Title (de)
VERFAHREN UND VORRICHTUNG ZUM MONTIEREN VON BAUELEMENTEN
Title (fr)
PROCEDE ET APPAREIL DE MONTAGE D'UN COMPOSANT
Publication
Application
Priority
- JP 2005010530 W 20050602
- JP 2004165976 A 20040603
Abstract (en)
[origin: WO2005120147A1] Reference marks arranged at specified intervals on a glass board are recognized, and from its recognition results, offset values for individual areas matching the board size are determined as numerical values for correction use, and further corresponding offset values for individual movement positions of a component placing head are reflected as numerical values for correction use in operation of placing position correction, mark recognition correction, or measurement of placing position offset values, respectively. Thus, high-accuracy placing is achieved. Moreover, correction of positional displacement of a component holding member due to an inclination of the component placing head is performed.
IPC 8 full level
H05K 13/04 (2006.01); H05K 13/08 (2006.01)
CPC (source: EP US)
H05K 13/041 (2018.07 - EP US); H05K 13/0812 (2018.07 - EP US); H05K 13/089 (2018.07 - EP US); Y10T 29/49133 (2015.01 - EP US); Y10T 29/53087 (2015.01 - EP US); Y10T 29/53178 (2015.01 - EP US); Y10T 29/53183 (2015.01 - EP US); Y10T 29/53187 (2015.01 - EP US)
Designated contracting state (EPC)
DE GB
DOCDB simple family (publication)
WO 2005120147 A1 20051215; CN 100589688 C 20100210; CN 1860837 A 20061108; DE 602005000512 D1 20070315; DE 602005000512 T2 20080131; EP 1671525 A1 20060621; EP 1671525 B1 20070124; JP 2005347555 A 20051215; JP 4128156 B2 20080730; US 2008250636 A1 20081016
DOCDB simple family (application)
JP 2005010530 W 20050602; CN 200580001123 A 20050602; DE 602005000512 T 20050602; EP 05750066 A 20050602; JP 2004165976 A 20040603; US 57185306 A 20060313