EP 1672684 A4 20100526 - MOUNTING DEVICE AND METHOD
Title (en)
MOUNTING DEVICE AND METHOD
Title (de)
ANBRINGEINRICHTUNG UND VERFAHREN
Title (fr)
DISPOSITIF ET PROCEDE DE MONTAGE
Publication
Application
Priority
- JP 2004014198 W 20040929
- JP 2003351900 A 20031010
Abstract (en)
[origin: EP1672684A1] There is provided a mounting apparatus capable of forming dicing tapes in the process of feeding-out a strip material, and sticking the dicing tape to a ring frame to fix a semiconductor wafer. The mounting apparatus 10 sticks the dicing tape to the ring frame RF to fix the semiconductor wafer to the ring frame in a state that the ring frame RF and the semiconductor wafer W are disposed on a table 11. The mounting apparatus 10 includes a pre-cut means 13 for forming a cut L in a state of half cut in a film FL of a strip material A to form a dicing tape T in the process of feeding out the strip material A and a sticking means 34 for peeling off the dicing tape from a base sheet S to stick the dicing tape to the ring frame RF.
IPC 8 full level
H01L 21/301 (2006.01); H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 21/52 (2006.01); H01L 21/68 (2006.01)
CPC (source: EP KR US)
H01L 21/30 (2013.01 - KR); H01L 21/48 (2013.01 - KR); H01L 21/67132 (2013.01 - EP US); H01L 21/6836 (2013.01 - EP US); H01L 21/78 (2013.01 - KR); H01L 2221/68327 (2013.01 - EP US); Y10T 156/1062 (2015.01 - EP US); Y10T 156/1075 (2015.01 - EP US); Y10T 156/1085 (2015.01 - EP US); Y10T 156/1322 (2015.01 - EP US); Y10T 156/1339 (2015.01 - EP US); Y10T 156/1352 (2015.01 - EP US)
Citation (search report)
- [XAY] US 2002187589 A1 20021212 - TSUJIMOTO MASAKI [JP]
- [YA] JP H10189694 A 19980721 - DISCO ENG SERVICE KK
- [A] US 5961768 A 19991005 - TSUJIMOTO MASAKI [JP]
- [A] US 2002056523 A1 20020516 - ISHINODA MUTSUO [JP]
- [A] EP 1320121 A2 20030618 - NITTO DENKO CORP [JP]
- See references of WO 2005036628A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 1672684 A1 20060621; EP 1672684 A4 20100526; EP 1672684 B1 20151209; CN 100437918 C 20081126; CN 1868038 A 20061122; JP 2005116928 A 20050428; JP 4444619 B2 20100331; KR 101059431 B1 20110825; KR 20060125720 A 20061206; SG 147427 A1 20081128; TW 200514188 A 20050416; TW I331786 B 20101011; US 2007131344 A1 20070614; US 8196632 B2 20120612; WO 2005036628 A1 20050421
DOCDB simple family (application)
EP 04788265 A 20040929; CN 200480029620 A 20040929; JP 2003351900 A 20031010; JP 2004014198 W 20040929; KR 20067006894 A 20040929; SG 2008075509 A 20040929; TW 93127520 A 20040910; US 57484704 A 20040929