EP 1680812 A2 20060719 - SEMICONDUCTOR CHIP HAVING FLIP-CHIP CONTACTS AND METHOD FOR PRODUCING THE SAME
Title (en)
SEMICONDUCTOR CHIP HAVING FLIP-CHIP CONTACTS AND METHOD FOR PRODUCING THE SAME
Title (de)
HALBLEITERCHIP MIT FLIP-CHIP-KONTAKTEN UND VERFAHREN ZUR HERSTELLUNG DESSELBEN
Title (fr)
PUCE A SEMI-CONDUCTEUR PRESENTANT DES CONTACTS DE PUCE RETOURNEE ET PROCEDE POUR PRODUIRE CETTE PUCE
Publication
Application
Priority
- DE 2004002440 W 20041103
- DE 10352349 A 20031106
Abstract (en)
[origin: WO2005045931A2] The invention relates to a semiconductor chip (1) having flip-chip contacts (2), whereby the flip-chip contacts (2) are placed on contact surfaces (3) of the active top side (4) of the semiconductor chip (1). The contact surfaces (3) are surrounded by a passivation layer (5) that covers the active top side (4) while leaving the contact surfaces (3) exposed. The passivation layer (5) comprises thickenings (6) that encircle the contact surfaces (3). A semiconductor layer (1) of this type with thickenings (6) encircling the contact surfaces (3) is protected from delamination when packing the semiconductor chip (1) to form a semiconductor component.
IPC 1-7
IPC 8 full level
H01L 21/56 (2006.01); H01L 23/485 (2006.01); H01L 23/498 (2006.01)
CPC (source: EP US)
H01L 24/05 (2013.01 - EP US); H01L 24/10 (2013.01 - EP US); H01L 24/13 (2013.01 - EP US); H01L 21/563 (2013.01 - EP US); H01L 23/3171 (2013.01 - EP US); H01L 23/49816 (2013.01 - EP US); H01L 2224/0401 (2013.01 - EP US); H01L 2224/05572 (2013.01 - EP US); H01L 2224/13 (2013.01 - EP US); H01L 2224/13006 (2013.01 - EP US); H01L 2224/13099 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2224/73204 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/0101 (2013.01 - EP US); H01L 2924/01014 (2013.01 - EP US); H01L 2924/01052 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/05042 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US)
Citation (search report)
See references of WO 2005045931A2
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 2005045931 A2 20050519; WO 2005045931 A3 20050811; DE 10352349 A1 20050623; DE 10352349 B4 20061116; EP 1680812 A2 20060719; US 2006270163 A1 20061130; US 7768137 B2 20100803
DOCDB simple family (application)
DE 2004002440 W 20041103; DE 10352349 A 20031106; EP 04802671 A 20041103; US 42943306 A 20060508