Global Patent Index - EP 1680814 A2

EP 1680814 A2 20060719 - METHOD AND DEVICE FOR CONNECTING CHIPS

Title (en)

METHOD AND DEVICE FOR CONNECTING CHIPS

Title (de)

VERFAHREN UND EINRICHTUNG ZUM VERBINDEN VON CHIPS

Title (fr)

PROCEDE ET DISPOSITIF DE CONNEXION DE PUCES

Publication

EP 1680814 A2 20060719 (FR)

Application

EP 04805792 A 20041028

Priority

  • FR 2004050549 W 20041028
  • FR 0350774 A 20031103

Abstract (en)

[origin: WO2005045934A2] The invention relates to an electronic device comprising: a circuit (20, 50) having a first and second face, said first face being fitted with electrical connecting means (22, 53); a transfer element (24, 50) comprising a first and second face, assembled with its first face placed against the second face of the active element, and comprising electrical connecting means (26, 62) on its second face, and; a connection (32, 56) between the electrical connecting means of the active element and those of the transfer element.

IPC 1-7

H01L 25/16; H01L 25/18

IPC 8 full level

H01L 21/60 (2006.01); H01L 21/603 (2006.01); H01L 23/31 (2006.01); H01L 25/18 (2006.01); H01L 27/148 (2006.01)

CPC (source: EP US)

H01L 23/3185 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); H01L 24/92 (2013.01 - EP US); H01L 24/96 (2013.01 - EP US); H01L 25/18 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/4824 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2224/83001 (2013.01 - EP US); H01L 2224/85001 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01061 (2013.01 - EP US); H01L 2924/01077 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H10F 39/15 (2025.01 - EP US)

C-Set (source: EP US)

  1. H01L 2224/48091 + H01L 2924/00014
  2. H01L 2924/10253 + H01L 2924/00
  3. H01L 2224/73265 + H01L 2224/32225 + H01L 2224/48227 + H01L 2924/00
  4. H01L 2924/12041 + H01L 2924/00
  5. H01L 2924/00014 + H01L 2224/45099
  6. H01L 2924/00014 + H01L 2224/45015 + H01L 2924/207

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

FR 2861895 A1 20050506; FR 2861895 B1 20060224; EP 1680814 A2 20060719; US 2007111567 A1 20070517; US 7569940 B2 20090804; WO 2005045934 A2 20050519; WO 2005045934 A3 20060302

DOCDB simple family (application)

FR 0350774 A 20031103; EP 04805792 A 20041028; FR 2004050549 W 20041028; US 57714204 A 20041028