Global Patent Index - EP 1680839 A1

EP 1680839 A1 20060719 - METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION AND A CONTACT ELEMENT PROVIDED WITH THE SUCH PRODUCED ELECTRIC CONNECTION

Title (en)

METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION AND A CONTACT ELEMENT PROVIDED WITH THE SUCH PRODUCED ELECTRIC CONNECTION

Title (de)

VERFAHREN ZUM HERSTELLEN EINER ELEKTRISCH LEITENDEN VERBINDUNG UND KONTAKTTEIL MIT EINER DERART HERGESTELLTEN ELEKTRISCHEN VERBINDUNG

Title (fr)

PROCEDE POUR REALISER UNE LIAISON ELECTRIQUEMENT CONDUCTRICE ET ELEMENT DE CONTACT DOTE D'UNE LIAISON ELECTRIQUE AINSI REALISEE

Publication

EP 1680839 A1 20060719 (DE)

Application

EP 04787031 A 20040928

Priority

  • EP 2004010831 W 20040928
  • DE 10352325 A 20031106

Abstract (en)

[origin: WO2005053099A1] The invention relates to a method for producing an electrically conductive connection between a contact element interacting with a corresponding counter-contact and several electric lines each of which consists of several wires consisting in placing the lines on a contact element supporting surface, controlling the lines integrity and in fixing said lines to the contact elements by resistance welding. In the particularly advantageous embodiments of said invention, the contact element is provided with crimping elements which surround and/or form an earth cable terminal screwed to a mass bolt.

IPC 1-7

H01R 11/00

IPC 8 full level

H01R 43/02 (2006.01); H01R 43/28 (2006.01)

CPC (source: EP US)

H01R 43/0214 (2013.01 - EP US); H01R 43/0249 (2013.01 - EP US); H01R 43/28 (2013.01 - EP US); Y10T 29/49179 (2015.01 - EP US); Y10T 29/49908 (2015.01 - EP US); Y10T 29/49924 (2015.01 - EP US); Y10T 29/5121 (2015.01 - EP US); Y10T 29/5183 (2015.01 - EP US)

Citation (search report)

See references of WO 2005053099A1

Citation (examination)

Designated contracting state (EPC)

DE ES FR GB IT SE

DOCDB simple family (publication)

WO 2005053099 A1 20050609; DE 10352325 A1 20050804; DE 10352325 B4 20131107; EP 1680839 A1 20060719; JP 2007510261 A 20070419; US 2006289195 A1 20061228; US 7568268 B2 20090804

DOCDB simple family (application)

EP 2004010831 W 20040928; DE 10352325 A 20031106; EP 04787031 A 20040928; JP 2006537092 A 20040928; US 41826606 A 20060505