Global Patent Index - EP 1681359 A1

EP 1681359 A1 20060719 - HIGH TEMPERATURE BOLT MATERIAL

Title (en)

HIGH TEMPERATURE BOLT MATERIAL

Title (de)

HOCHTEMPERATURBOLZENMATERIAL

Title (fr)

MATERIAU DE BOULON HAUTE TEMPERATURE

Publication

EP 1681359 A1 20060719 (EN)

Application

EP 04772713 A 20040827

Priority

  • JP 2004012764 W 20040827
  • JP 2003306103 A 20030829

Abstract (en)

A high temperature bolt material, characterized in that it is a ferrite steel comprising 8 wt % or more of Cr and having a tempered martensite structure and can be used in a high temperature region of higher than 500°C; and a method for producing the high temperature bolt material which comprises subjecting the above-mentioned steel material to a heat treatment comprising a quenching or normalizing at a temperature of 1000°C or higher and then to a tempering at a temperature of 730°C or higher. The above ferrite steel high temperature bolt material is excellent in characteristics of the resistance to stress relaxation.

IPC 1-7

C21D 9/00; C22C 38/00; C22C 38/18; C22C 38/54; F01D 25/24; F02C 7/00

IPC 8 full level

C21D 9/00 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/18 (2006.01); C22C 38/22 (2006.01); C22C 38/24 (2006.01); C22C 38/26 (2006.01); C22C 38/30 (2006.01); C22C 38/32 (2006.01); C22C 38/54 (2006.01); F01D 25/24 (2006.01); F02C 7/00 (2006.01); C21D 1/18 (2006.01); C21D 1/28 (2006.01); C21D 6/00 (2006.01)

CPC (source: EP US)

C21D 9/0093 (2013.01 - EP US); C22C 38/02 (2013.01 - EP US); C22C 38/04 (2013.01 - EP US); C22C 38/22 (2013.01 - EP US); C22C 38/24 (2013.01 - EP US); C22C 38/26 (2013.01 - EP US); C22C 38/30 (2013.01 - EP US); C22C 38/32 (2013.01 - EP US); F01D 25/243 (2013.01 - EP US); C21D 1/18 (2013.01 - EP US); C21D 1/28 (2013.01 - EP US); C21D 6/002 (2013.01 - EP US)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 1681359 A1 20060719; EP 1681359 A4 20090311; JP 2005076062 A 20050324; US 2008216927 A1 20080911; WO 2005021806 A1 20050310

DOCDB simple family (application)

EP 04772713 A 20040827; JP 2003306103 A 20030829; JP 2004012764 W 20040827; US 56948504 A 20040827