EP 1684316 A1 20060726 - A resin encapsulated device and method of manufacture
Title (en)
A resin encapsulated device and method of manufacture
Title (de)
Vergussgekapselte Vorrichtung und Verfahren zur Herstellung
Title (fr)
Dispositif encapsulé en résine et procédé de fabrication
Publication
Application
Priority
EP 05250267 A 20050120
Abstract (en)
A resin encapsulated device (1) comprising a housing (2) defining a hollow body, a sensitive component (4) at least partly located within the housing, a resin material provided within the housing to at least partially encapsulate the component, characterised by a rigid buffer element (5) embedded within the resin material adjacent at least one component to prevent the origination of cracks within the resin material and/or to prevent cracks which might propagate within the resin material from reaching the component.
IPC 8 full level
H01F 27/32 (2006.01); H01F 38/12 (2006.01); H01F 41/00 (2006.01)
CPC (source: EP)
H01F 41/005 (2013.01); H01F 27/306 (2013.01)
Citation (search report)
- [X] US 2003189476 A1 20031009 - NAGATA TAKASHI [JP], et al
- [X] US 6525636 B1 20030225 - OOSUKA KAZUTOYO [JP], et al
- [A] GB 2345799 A 20000719 - TAIYO YUDEN KK [JP]
- [A] US 5662091 A 19970902 - SAWAZAKI NOBUYUKI [JP], et al
- [A] US 4866409 A 19890912 - UMEZAKI TOMOKAZU [JP]
- [A] US 4174510 A 19791113 - HELENBERG HAROLD W [US], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
DOCDB simple family (application)
EP 05250267 A 20050120