Global Patent Index - EP 1688022 A1

EP 1688022 A1 20060809 - ELECTRIC CIRCUIT ARRANGEMENT

Title (en)

ELECTRIC CIRCUIT ARRANGEMENT

Title (de)

ELEKTRISCHE SCHALTUNGSANORDNUNG

Title (fr)

CIRCUIT ELECTRIQUE

Publication

EP 1688022 A1 20060809 (DE)

Application

EP 04797703 A 20041108

Priority

  • EP 2004012607 W 20041108
  • DE 10355921 A 20031129

Abstract (en)

[origin: WO2005053366A1] The invention relates to an electric circuit arrangement (1) comprising an interconnect device (2) that is equipped with a chip (3). Said interconnect device (2) contains a substrate (4), in which a receiving recess (5) is configured that is closed on all sides. First contact pads that are connected to printed conductors (6) are provided on the base. Said pads are electrically connected to second contact pads (17) of the chip (3) that is positioned above the first pads by the interposition of a contact element (24) that is an anisotropic electric conductor and simultaneously elastically deformable. A force exertion structure that is fixed to the substrate (4) exerts a force on the upper face of the chip (3) to produce the contact pressure required for the establishment of electrical contact.

IPC 8 full level

H05K 1/11 (2006.01); H01L 23/13 (2006.01); H01L 23/32 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H05K 3/32 (2006.01); H05K 1/00 (2006.01); H05K 1/18 (2006.01)

CPC (source: EP)

H01L 23/13 (2013.01); H01L 23/32 (2013.01); H01L 24/72 (2013.01); H05K 3/325 (2013.01); H01L 23/49827 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/0101 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/14 (2013.01); H05K 1/0284 (2013.01); H05K 1/119 (2013.01); H05K 1/183 (2013.01); H05K 2201/0314 (2013.01)

Citation (search report)

See references of WO 2005053366A1

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

WO 2005053366 A1 20050609; CN 1887036 A 20061227; DE 10355921 A1 20050630; DE 10355921 B4 20051222; EP 1688022 A1 20060809; TW 200537655 A 20051116

DOCDB simple family (application)

EP 2004012607 W 20041108; CN 200480035184 A 20041108; DE 10355921 A 20031129; EP 04797703 A 20041108; TW 93136093 A 20041124