EP 1694466 A1 20060830 - A POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING
Title (en)
A POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING
Title (de)
POLIERKISSEN FÜR CHEMISCH-MECHANISCHES POLIEREN
Title (fr)
TAMPON A POLIR POUR POLISSAGE MECANO-CHIMIQUE
Publication
Application
Priority
- US 2004030013 W 20040914
- US 50315203 P 20030915
Abstract (en)
[origin: US2005055885A1] The present invention provides in one embodiment, a polishing pad 100 for chemical mechanical polishing. The polishing pad comprises a polishing body 110. The polishing body comprises a thermoplastic foam substrate 115 having a surface 120 comprising concave cells 125. A polishing agent 130 coats an interior surface 135 of the concave cells. The polishing agent comprises an inorganic metal oxide that includes carbides or nitrides. Yet another embodiment of the present invention is a method for preparing a polishing pad 200.
IPC 8 full level
B24D 3/26 (2006.01); B24B 37/04 (2006.01); B24D 3/34 (2006.01); B24D 13/14 (2006.01)
CPC (source: EP US)
B24D 3/26 (2013.01 - EP US); B24D 3/348 (2013.01 - EP US); B24D 13/147 (2013.01 - EP US)
Citation (search report)
See references of WO 2005028157A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2005055885 A1 20050317; CN 1863644 A 20061115; EP 1694466 A1 20060830; JP 2007505749 A 20070315; TW 200525017 A 20050801; WO 2005028157 A1 20050331
DOCDB simple family (application)
US 94058204 A 20040914; CN 200480029047 A 20040914; EP 04784014 A 20040914; JP 2006526974 A 20040914; TW 93127776 A 20040914; US 2004030013 W 20040914