EP 1697989 A2 20060906 - CONNECTOR FOR MAKING ELECTRICAL CONTACT AT SEMICONDUCTOR SCALES AND METHOD FOR FORMING SAME
Title (en)
CONNECTOR FOR MAKING ELECTRICAL CONTACT AT SEMICONDUCTOR SCALES AND METHOD FOR FORMING SAME
Title (de)
VERBINDER ZUR HERSTELLUNG EINES ELEKTRISCHEN KONTAKTS AUF HALBLEITERMASSSTÄBEN UND VERFAHREN ZU SEINER BILDUNG
Title (fr)
CONNECTEUR PERMETTANT D'ETABLIR UN CONTACT ELECTRIQUE A DES ECHELLES DE SEMI-CONDUCTEURS ET PROCEDE DE FORMATION ASSOCIE
Publication
Application
Priority
- US 2004040868 W 20041207
- US 73166903 A 20031208
- US 73121303 A 20031208
Abstract (en)
[origin: WO2005057652A2] A connector, and method for forming same, for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.
IPC 8 full level
H01L 23/48 (2006.01); G01R 1/067 (2006.01); H01L 23/00 (2006.01); H01R 13/03 (2006.01); H01R 13/24 (2006.01); H01R 43/00 (2006.01); H05K 3/40 (2006.01); H05K 7/10 (2006.01); G01R 3/00 (2006.01); H01L 23/32 (2006.01); H01R 43/20 (2006.01); H05K 3/32 (2006.01)
CPC (source: EP)
G01R 1/06711 (2013.01); G01R 1/07342 (2013.01); H01L 24/72 (2013.01); H01R 12/52 (2013.01); H01R 12/714 (2013.01); H01R 13/03 (2013.01); H01R 13/2407 (2013.01); H01R 13/2492 (2013.01); H01R 43/007 (2013.01); H05K 3/4092 (2013.01); H05K 7/1069 (2013.01); G01R 3/00 (2013.01); H01L 23/32 (2013.01); H01L 24/45 (2013.01); H01L 2224/45144 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/3011 (2013.01); H01R 43/205 (2013.01); H05K 3/326 (2013.01)
Citation (search report)
See references of WO 2005057652A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005057652 A2 20050623; WO 2005057652 A3 20060105; EP 1697989 A2 20060906; TW 200532880 A 20051001; TW I257695 B 20060701
DOCDB simple family (application)
US 2004040868 W 20041207; EP 04813215 A 20041207; TW 93137786 A 20041207