EP 1699892 A1 20060913 - ADHESIVE FILM USED TO IMPLANT ELECTRIC MODULES IN A CARD BODY
Title (en)
ADHESIVE FILM USED TO IMPLANT ELECTRIC MODULES IN A CARD BODY
Title (de)
KLEBFOLIE ZUR IMPLANTIERUNG VON ELEKTRISCHEN MODULEN IN EINEN KARTENK RPER
Title (fr)
FILM ADHESIF DESTINE A L'IMPLANTATION DE MODULES ELECTRIQUES DANS UN CORPS CARTE
Publication
Application
Priority
- EP 2004053632 W 20041221
- DE 10361541 A 20031223
Abstract (en)
[origin: WO2005063909A1] The invention relates to an adhesive film, comprising a blend made of synthetic rubber S1 and thermoplastics 2 which are used to stick electric modules to chip cards. According to the invention, a) the blend is separated into microphases; b) the blend has at least two softening temperatures, wherein at least one softening temperature is higher than 65 DEG C and lower than 125 DEG C; c) a G' measured according to test method A at 23 DEG C is 10<7> Pas; d) a G" measured according to test method A at 23 DEG C is 10<6 >Pas; e) and a crossover measured according to test method A is less than 125 DEG C.
IPC 8 full level
C09J 7/10 (2018.01); G06K 19/077 (2006.01)
CPC (source: EP US)
C09J 7/10 (2017.12 - EP US); G06K 19/07745 (2013.01 - EP); G06K 19/07747 (2013.01 - EP US); C09J 2203/326 (2013.01 - EP); C09J 2301/304 (2020.08 - EP); C09J 2421/00 (2013.01 - EP); H01L 2924/0002 (2013.01 - EP)
Citation (search report)
See references of WO 2005063909A1
Designated contracting state (EPC)
DE ES FR GB IT NL
DOCDB simple family (publication)
WO 2005063909 A1 20050714; DE 10361541 A1 20050728; DE 112004002184 D2 20060914; EP 1699892 A1 20060913; MX PA06007085 A 20060904
DOCDB simple family (application)
EP 2004053632 W 20041221; DE 10361541 A 20031223; DE 112004002184 T 20041221; EP 04804967 A 20041221; MX PA06007085 A 20041221