EP 1702165 B1 20151230 - ASSEMBLY USED FOR COOLING A CIRCUIT BOARD OR SIMILAR
Title (en)
ASSEMBLY USED FOR COOLING A CIRCUIT BOARD OR SIMILAR
Title (de)
ANORDNUNG FÜR DIE KÜHLUNG EINER LEITERPLATTE ODER DERGLEICHEN
Title (fr)
DISPOSITIF POUR REFROIDIR UNE CARTE DE CIRCUITS OU SIMILAIRE
Publication
Application
Priority
- EP 2005010652 W 20051004
- DE 202004019747 U 20041019
- DE 202005015079 U 20050919
Abstract (en)
[origin: WO2006042635A1] Disclosed is a supporting frame (104) that is to be mounted on a printed circuit board (2), is embodied like a drilling rig, and comprises a platform (117) which is provided with supporting legs (105, 106, 107, 108) for fixing the same to the circuit board (2). The center of the platform (42) of the supporting frame (104) encompasses a depression (121, 123) which is configured for assembling a fan (3) at a distance from the circuit board (2). The outer wall (123) of the depression (121, 123) forms part of the fan.
IPC 8 full level
F04D 29/54 (2006.01)
CPC (source: EP US)
F04D 19/002 (2013.01 - EP US); F04D 25/0613 (2013.01 - EP US); F04D 25/0693 (2013.01 - EP); F04D 29/541 (2013.01 - EP US); F04D 29/601 (2013.01 - EP)
Citation (examination)
- WO 9907196 A2 19990211 - CHECCHETTI MAURIZIO [IT]
- US 5975194 A 19991102 - WAGNER GUY R [US], et al
- US 6130820 A 20001010 - KONSTAD ROLF A [US], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2006042635 A1 20060427; EP 1702165 A1 20060920; EP 1702165 B1 20151230; EP 2436933 A2 20120404; EP 2436933 A3 20180124; EP 2436933 A8 20120516; EP 2436933 B1 20200603; US 2006228237 A1 20061012; US 7390172 B2 20080624
DOCDB simple family (application)
EP 2005010652 W 20051004; EP 05791377 A 20051004; EP 11009570 A 20051004; US 57498806 A 20060406