Global Patent Index - EP 1705261 A1

EP 1705261 A1 20060927 - Method of depositing a wear-resistant coating by thermal spraying

Title (en)

Method of depositing a wear-resistant coating by thermal spraying

Title (de)

Verfahren zur Abscheidung einer Verschleißschutzschicht durch thermisches Spritzen

Title (fr)

Procédé de dépôt par projection thermique d'un revêtement anti-usure

Publication

EP 1705261 A1 20060927 (FR)

Application

EP 06111543 A 20060322

Priority

FR 0502865 A 20050323

Abstract (en)

Thermal projection of a copper/nickel/indium alloy as an anti-wear coating on a mechanical part is effected by an Activated Combustion High Velocity Air Fuel (AC-HVAF) process.

IPC 8 full level

C23C 4/12 (2006.01); C23C 4/08 (2006.01); F01D 5/28 (2006.01)

CPC (source: EP US)

C23C 4/06 (2013.01 - EP US); C23C 4/12 (2013.01 - EP US); F01D 5/288 (2013.01 - EP US); F05D 2230/31 (2013.01 - EP US); F05D 2300/1723 (2013.01 - EP US)

Citation (applicant)

Citation (search report)

  • [A] US 6245390 B1 20010612 - BARANOVSKI VIATCHESLAV [US], et al
  • [A] WO 9736692 A1 19971009 - METALSPRAY U S A INC [US]
  • [A] EP 0678590 A1 19951025 - UNITED TECHNOLOGIES CORP [US]
  • [A] US 2001026845 A1 20011004 - KNIGHT RICHARD [US], et al
  • [A] US 5271965 A 19931221 - BROWNING JAMES A [US]
  • [A] US 5601933 A 19970211 - HAJMRLE KAREL [CA], et al
  • [A] WO 03073804 A2 20030904 - SNECMA SERVICES [FR], et al
  • [XY] WIELAGE B: "Abschlussbericht zum Forschungsvorhaben Herstellung SiC-haltiger Verbundschichten für hochbeanspruchte Bauteile und Werkzeuge mittels des HVOF-Verfahrens", 24 May 2001, LEHRSTUHL FÜR VERBUNDWERKSTOFFE, FAKULTÄT FÜR MASCHINENBAU UND VERFAHRENSTECHNIK, TECHNISCHE UNIVERSITÄT CHEMNITZ (DE), XP002389046
  • [Y] FRIDRICI V ET AL: "Fretting wear behavior of a Cu-Ni-In plasma coating", SURFACE & COATINGS TECHNOLOGY ELSEVIER SWITZERLAND, vol. 163-164, 30 January 2003 (2003-01-30), pages 429 - 434, XP002340202, ISSN: 0257-8972

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 1705261 A1 20060927; CA 2540266 A1 20060923; CN 1896312 A 20070117; FR 2883574 A1 20060929; FR 2883574 B1 20080118; JP 2006266264 A 20061005; US 2006216429 A1 20060928

DOCDB simple family (application)

EP 06111543 A 20060322; CA 2540266 A 20060321; CN 200610065915 A 20060323; FR 0502865 A 20050323; JP 2006078590 A 20060322; US 38573406 A 20060322