EP 1706521 A2 20061004 - METHOD FOR CONTROLLING ELECTRODEPOSITION OF AN ENTITY AND DEVICES INCORPORATING THE IMMOBILIZED ENTITY
Title (en)
METHOD FOR CONTROLLING ELECTRODEPOSITION OF AN ENTITY AND DEVICES INCORPORATING THE IMMOBILIZED ENTITY
Title (de)
VERFAHREN ZUR STEUERUNG DER ELEKTROABSCHEIDUNG EINER EINHEIT UND DIE IMMOBILISIERTE EINHEIT BEINHALTENDE VORRICHTUNGEN
Title (fr)
PROCEDE DESTINE A REGULER L'ELECTRODEPOSITION D'UNE ENTITE ET DISPOSITIFS COMPRENANT CETTE ENTITE IMMOBILISEE
Publication
Application
Priority
- US 2004039470 W 20041124
- US 72274003 A 20031126
Abstract (en)
[origin: US2005109622A1] The present invention relates to a method and system for controlling electrodeposition of a deposition entity in which a solution or suspension of the deposition entity is provided between a pair of superposed electrodes at a predetermined concentration. A potential is applied to the electrodes sufficient to cause migration of the deposition entity to one of the electrodes and deposition of a controlled thickness of the deposition entity. The distance between the electrodes and voltage applied can be controlled to provide migration of the deposition entity. The method and system provide controlled immobilization of deposition entities such as proteins, enzymes, light harvesting complexes, DNA, RNA, PNA onto a substrate without loss of function. In one embodiment, the system can be used on a nanoscale. Additionally, devices can be formed by the method of the present invention.
IPC 8 full level
C25D 13/04 (2006.01); C25D 13/22 (2006.01); C25D 15/00 (2006.01); C25D 17/00 (2006.01); G01N 27/403 (2006.01); H01L 51/00 (2006.01); H01L 51/30 (2006.01); H01L 51/40 (2006.01)
CPC (source: EP KR US)
B82Y 5/00 (2013.01 - EP US); B82Y 10/00 (2013.01 - EP US); C25D 13/04 (2013.01 - EP US); C25D 13/22 (2013.01 - EP US); C25D 15/00 (2013.01 - KR); G01N 27/403 (2013.01 - KR); B82Y 5/00 (2013.01 - KR); H10K 71/125 (2023.02 - EP US); H10K 85/761 (2023.02 - EP US)
Citation (search report)
See references of WO 2005054838A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2005109622 A1 20050526; AU 2004294552 A1 20050616; BR PI0416429 A 20070221; CA 2549835 A1 20050616; CN 1902340 A 20070124; EP 1706521 A2 20061004; JP 2007512439 A 20070517; KR 20060096463 A 20060911; MX PA06005996 A 20060823; TW 200525151 A 20050801; WO 2005054838 A2 20050616; WO 2005054838 A3 20060112
DOCDB simple family (application)
US 72274003 A 20031126; AU 2004294552 A 20041124; BR PI0416429 A 20041124; CA 2549835 A 20041124; CN 200480039155 A 20041124; EP 04812067 A 20041124; JP 2006541690 A 20041124; KR 20067012495 A 20060622; MX PA06005996 A 20041124; TW 93136320 A 20041125; US 2004039470 W 20041124