EP 1714727 A3 20061227 - Process and device for applying solder
Title (en)
Process and device for applying solder
Title (de)
Verfahren zum Aufbringen von Lot und Vorrichtung hierfür
Title (fr)
Procédé et appareil d'application d'une brasure
Publication
Application
Priority
DE 102005018413 A 20050420
Abstract (en)
[origin: EP1714727A2] A soldering process for applying solder paste (2) to a part (1), especially to partly cover the part surface, comprises using at least one roller (4) to apply the paste. Preferably the paste is only applied to the required surface areas, and preferably the paste is applied evenly using a doctor blade (5). An independent claim is also included for a device for the above process comprising at least one roller.
IPC 8 full level
CPC (source: EP)
B23K 1/0012 (2013.01); B23K 3/0638 (2013.01); H05K 3/3485 (2020.08); H05K 2203/0143 (2013.01)
Citation (search report)
- [XY] US 5139822 A 19920818 - HEPLER DON R [US], et al
- [Y] US 2003073561 A1 20030417 - UTSUMI TORU [JP], et al
- [Y] JP 2003071344 A 20030311 - NIPPON ELECTRIC KAGOSHIMA LTD
- [Y] JP H09314010 A 19971209 - NICHIHA KK
- [Y] JP 2003284981 A 20031007 - KYOCERA CORP
- [X] DE 4132165 A1 19930401 - CASTOLIN SA [CH]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK YU
DOCDB simple family (publication)
DOCDB simple family (application)
EP 06005713 A 20060321