EP 1716578 A4 20091111 - NANOSCALE METAL PASTE FOR INTERCONNECT AND METHOD OF USE
Title (en)
NANOSCALE METAL PASTE FOR INTERCONNECT AND METHOD OF USE
Title (de)
NANOMASSSTAB-METALLPASTE ZUR VERBINDUNG UND BENUTZUNGSVERFAHREN
Title (fr)
PATE METALLIQUE NANOMETRIQUE POUR INTERCONNEXION ET PROCEDE D'UTILISATION
Publication
Application
Priority
- US 2005004567 W 20050214
- US 54513904 P 20040218
Abstract (en)
[origin: WO2005079353A2] A paste including metal or metal alloy particles (which are preferably silver or silver alloy), a dispersant material, and a binder is used to form an electrical, mechanical or thermal interconnect between a device and a substrate. By using nano scale particles (i.e., those which are less than 500 nm in size and most preferably less than 100 nm in size), the metal or metal alloy particles can be sintered at a low temperature to form a metal or metal alloy layer which is desired to allow good electrical, thermal and mechanical bonding, yet the metal or metal alloy layer can enable usage at a high temperature such as would be desired for SiC, GaN, or diamond (e.g., wide bandgap devices). Furthermore, significant application of pressure to form the densified layers is not required, as would be the case with micrometer sized particles. In addition, the binder can be varied so as to insulate the metal particles until a desired sintering temperature is reached; thereby permitting fast and complete sintering to be achieved.
IPC 8 full level
H01B 1/22 (2006.01); H01B 1/24 (2006.01); H01L 21/60 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP KR US)
B23K 35/0244 (2013.01 - EP); B23K 35/3006 (2013.01 - EP); B82B 3/00 (2013.01 - KR); C22C 1/0466 (2013.01 - EP); H01B 1/22 (2013.01 - EP KR); H01L 24/27 (2013.01 - EP US); H01L 24/29 (2013.01 - EP); H05K 1/097 (2013.01 - EP); H05K 3/321 (2013.01 - EP); H05K 3/3485 (2020.08 - EP); B22F 2998/00 (2013.01 - EP); B22F 2998/10 (2013.01 - EP); B82Y 30/00 (2013.01 - KR); H01L 2224/27332 (2013.01 - EP); H01L 2224/29101 (2013.01 - EP); H01L 2224/29111 (2013.01 - EP); H01L 2224/2919 (2013.01 - EP); H01L 2224/29339 (2013.01 - EP); H01L 2224/29399 (2013.01 - EP); H01L 2224/83801 (2013.01 - EP); H01L 2224/8384 (2013.01 - EP); H01L 2924/01005 (2013.01 - EP); H01L 2924/01006 (2013.01 - EP); H01L 2924/01011 (2013.01 - EP); H01L 2924/01013 (2013.01 - EP); H01L 2924/01019 (2013.01 - EP); H01L 2924/01023 (2013.01 - EP); H01L 2924/01029 (2013.01 - EP); H01L 2924/01033 (2013.01 - EP); H01L 2924/01046 (2013.01 - EP); H01L 2924/01047 (2013.01 - EP); H01L 2924/01049 (2013.01 - EP); H01L 2924/0105 (2013.01 - EP); H01L 2924/0106 (2013.01 - EP); H01L 2924/01074 (2013.01 - EP); H01L 2924/01078 (2013.01 - EP); H01L 2924/01079 (2013.01 - EP); H01L 2924/01082 (2013.01 - EP); H01L 2924/0132 (2013.01 - EP); H01L 2924/01322 (2013.01 - EP); H01L 2924/014 (2013.01 - EP); H01L 2924/0665 (2013.01 - EP); H01L 2924/10272 (2013.01 - EP); H01L 2924/1033 (2013.01 - EP); H01L 2924/12041 (2013.01 - EP); H01L 2924/14 (2013.01 - EP); H01L 2924/19041 (2013.01 - EP); H01L 2924/19043 (2013.01 - EP); H01L 2924/3025 (2013.01 - EP); H05K 3/341 (2013.01 - EP); H05K 2203/1126 (2013.01 - EP); H05K 2203/1131 (2013.01 - EP); H05K 2203/1453 (2013.01 - EP)
Citation (search report)
- [Y] WO 2004005413 A1 20040115 - NANOPOWDERS IND LTD [IL], et al
- [Y] JP H07126556 A 19950516 - TATSUTA DENSEN KK
- [DY] ZHANG Z ET AL: "PRESSURE-ASSISTED LOW-TEMPERATURE SINTERING OF SILVER PASTE AS AN ALTERNATIVE DIE-ATTACH SOLUTION TO SOLDER REFLOW", IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 25, no. 4, 1 October 2002 (2002-10-01), pages 279 - 283, XP001143650, ISSN: 1523-334X
- [A] WONG WAI KWAN ET AL: "Low temperature sintering process for deposition of nano-structured metal for nano IC packaging", ELECTRONICS PACKAGING TECHNOLOGY, 2003 5TH CONFERENCE (EPTC 2003) DEC. 10-12, 2003, PISCATAWAY, NJ, USA,IEEE, 10 December 2003 (2003-12-10), pages 551 - 556, XP010687352, ISBN: 978-0-7803-8205-3
- [PA] ZHANG ZHIYE ET AL: "NANOSCALE SILVER SINTERING FOR HIGH-TEMPERATURE PACKAGING OF SEMICONDUCTOR DEVICES", MATERIALS PROCESSING AND MANUFACTURING DIVISION. GLOBAL SYMPOSIUM SURFACES AND INTERFACES IN NANOSTRUCTURED MATERIALS AND TRENDS IN LIGA, MINIATURIZATION AND NANOSCALE MATERIALS, 14-18 MARCH, CHARLOTTE, NC, US, 2004, TMS, WARRENDALE, PA, US, pages 129 - 135, XP001248317
- See references of WO 2005079353A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005079353 A2 20050901; WO 2005079353 A3 20051208; CN 1961381 A 20070509; EP 1716578 A2 20061102; EP 1716578 A4 20091111; JP 2007527102 A 20070920; KR 20070033329 A 20070326
DOCDB simple family (application)
US 2005004567 W 20050214; CN 200580010570 A 20050214; EP 05723019 A 20050214; JP 2006554151 A 20050214; KR 20067019146 A 20060918