EP 1719173 A1 20061108 - Method of manufacturing a MICROELECTRONIC INTERCONNECT DEVICE COMPRISING LOCALISED CONDUCTIVE PINS
Title (en)
Method of manufacturing a MICROELECTRONIC INTERCONNECT DEVICE COMPRISING LOCALISED CONDUCTIVE PINS
Title (de)
Herstellungsverfahren für eine MIKROELEKTRONISCHE VERBINDUNGSEINRICHTUNG MIT LOKALISIERTEN LEITFÄHIGEN PINS
Title (fr)
Procédé de fabrication d'un DISPOSITIF MICROELECTRONIQUE D'INTERCONNEXION A TIGES CONDUCTRICES LOCALISEES
Publication
Application
Priority
- FR 2005050123 W 20050224
- FR 0450349 A 20040225
Abstract (en)
[origin: FR2866753A1] Fabrication of conducting pins (310) endowed with one or more conductor contacts (302), each coming into contact with an electronic component contact, comprises: (a) deposition of a masking layer on a component; (b) formation of holes in the masking layer; (c) filling these holes with a conducting material to form the conducting pins; (d) removing the masking layer. An independent claim is also included for micro-electronic devices obtained by this method.
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/00 (2006.01); H01L 23/485 (2006.01); H01L 23/498 (2006.01)
CPC (source: EP US)
H01L 23/49811 (2013.01 - EP US); H01L 24/05 (2013.01 - EP US); H01L 24/11 (2013.01 - EP US); H01L 24/12 (2013.01 - EP US); H01L 24/16 (2013.01 - EP US); H01L 2224/0401 (2013.01 - EP US); H01L 2224/04042 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/114 (2013.01 - EP US); H01L 2224/1147 (2013.01 - EP US); H01L 2224/116 (2013.01 - EP US); H01L 2224/13078 (2013.01 - EP US); H01L 2224/13099 (2013.01 - EP US); H01L 2224/48463 (2013.01 - EP US); H01L 2224/83192 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01022 (2013.01 - EP US); H01L 2924/01028 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US)
Citation (search report)
See references of WO 2005086232A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2866753 A1 20050826; FR 2866753 B1 20060609; EP 1719173 A1 20061108; US 2007166978 A1 20070719; US 7563703 B2 20090721; WO 2005086232 A1 20050915
DOCDB simple family (application)
FR 0450349 A 20040225; EP 05717721 A 20050224; FR 2005050123 W 20050224; US 59041205 A 20050224