EP 1721715 A1 20061115 - Chip board panel, method and apparatus of manufacturing the panel
Title (en)
Chip board panel, method and apparatus of manufacturing the panel
Title (de)
OSB-Platte sowie Verfahren und Vorrichtung zu ihrer Herstellung
Title (fr)
Plaque composite en bois, procédé et appareil pour la fabrication de la plaque
Publication
Application
Priority
DE 102005021903 A 20050512
Abstract (en)
The method involves arranging wood chips or wood fibers glued with resin in several layers (6, 7, 8) to form a splinter or fiber cake and pressing the wood chips or wood fibers together by applying pressure and temperature. At least one layer material insert (4, 5), in particular a fleece, a fabric, plastic or paper insert, is introduced between the layers before pressing and is pressed with the wood fibers or wood chips. Independent claims are also included for the following: (A) a wood material board (B) and a device for manufacturing a wood material board .
IPC 8 full level
B27N 3/06 (2006.01)
CPC (source: EP)
Citation (search report)
- [X] US 4569873 A 19860211 - ROBBINS EARL H [US]
- [X] US 3790417 A 19740205 - REIMSCHUESSEL A, et al
- [X] DE 19746383 A1 19990422 - HOFA HOMANN GMBH & CO KG [DE]
- [A] US 4655861 A 19870407 - KISS GUENTER H [DE]
- [A] US 4198460 A 19800415 - KISS GUNTER H [DE]
- [A] DE 10300247 A1 20040722 - KRONOTEC AG [CH]
- [DA] DE 4434876 A1 19960404 - DIEFFENBACHER GMBH MASCHF [DE]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA HR MK YU
DOCDB simple family (publication)
EP 1721715 A1 20061115; EP 1721715 B1 20100818; AT E477897 T1 20100915; DE 102005021903 A1 20061116; DE 102005021903 B4 20080710; DE 502006007671 D1 20100930; ES 2349871 T3 20110112; PL 1721715 T3 20110228
DOCDB simple family (application)
EP 06007021 A 20060401; AT 06007021 T 20060401; DE 102005021903 A 20050512; DE 502006007671 T 20060401; ES 06007021 T 20060401; PL 06007021 T 20060401