EP 1722013 A4 20070808 - ELECTROPLATING IN PRESENCE OF CO2
Title (en)
ELECTROPLATING IN PRESENCE OF CO2
Title (de)
GALVANISIERUNG IN GEGENWART VON CO2
Title (fr)
GALVANOPLASTIE EN PRESENCE DE CO2
Publication
Application
Priority
- JP 2005002179 W 20050214
- JP 2004035281 A 20040212
- JP 2004349651 A 20041202
Abstract (en)
[origin: US2007175763A1] The present invention provides a method for conducting electroplating in the presence of CO<SUB>2 </SUB>and a metal salt-containing aqueous solution, wherein the CO<SUB>2 </SUB>is in the form of liquid, subcritical or supercritical, the method being characterized in that a nonionic compound having a CO<SUB>2</SUB>-affinitive moiety is further added to the system where the aqueous solution and CO<SUB>2 </SUB>coexist. The method of the present invention improves the efficiency of the electrochemical reaction process and enables formation of an excellent metal film.
IPC 8 full level
C25D 3/02 (2006.01); B01J 3/00 (2006.01); C25D 5/00 (2006.01)
CPC (source: EP KR US)
C25D 3/02 (2013.01 - EP KR US); C25D 5/003 (2013.01 - EP US)
Citation (search report)
- No further relevant documents disclosed
- See references of WO 2005078161A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2007175763 A1 20070802; EP 1722013 A1 20061115; EP 1722013 A4 20070808; JP 2005256162 A 20050922; JP 4673612 B2 20110420; KR 20070001174 A 20070103; WO 2005078161 A1 20050825
DOCDB simple family (application)
US 58926305 A 20050214; EP 05710181 A 20050214; JP 2004349651 A 20041202; JP 2005002179 W 20050214; KR 20067018505 A 20060911