EP 1723406 A1 20061122 - MICRO-STRUCTURED SENSOR
Title (en)
MICRO-STRUCTURED SENSOR
Title (de)
MIKROSTRUKTURIERTER SENSOR
Title (fr)
CAPTEUR MICROSTRUCTURE
Publication
Application
Priority
- DE 2005000040 W 20050114
- DE 102004010499 A 20040304
Abstract (en)
[origin: WO2005085808A1] The invention relates to a micro-structured sensor, comprising at least one measuring chip (2), wherein a first measuring area (6), comprising a first measuring structure, and a second measuring area (7) comprising a second measuring structure, is embodied, and the measuring areas (6, 7) are offset in relation to each other in a lateral direction (Y). Said micro-structured sensor also comprises a cup chip (4) which is secured, in a connecting area and in an air-tight manner, to the measuring chip (2), an intermediate chamber which is embodied between the measuring chip (2) and the cup chip (4), said intermediate chamber being sealed from the outside by the connecting area (3) and the measuring areas (6, 7) are arranged therein, and at least one contact area (20, 22), which is used to contact the measuring chip (2), is released by the cup chip (4) and is embodied on the measuring chip. The sensor can be, in particular, a gas sensor which is used to measure gas concentration or an accleration sensor.
IPC 8 full level
G01N 21/35 (2006.01); B81B 7/02 (2006.01); G01J 1/04 (2006.01); G01J 5/12 (2006.01); G01P 1/02 (2006.01); G01P 15/00 (2006.01); G01P 15/18 (2013.01); G01N 21/31 (2006.01)
CPC (source: EP KR US)
B81B 7/00 (2013.01 - KR); B81B 7/02 (2013.01 - KR); G01J 1/04 (2013.01 - EP US); G01J 5/12 (2013.01 - EP KR US); G01N 21/3504 (2013.01 - EP KR US); G01P 1/023 (2013.01 - EP US); G01P 15/18 (2013.01 - EP US); G01J 1/0204 (2013.01 - EP US); G01N 2021/3177 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48145 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/48472 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); Y10T 29/49002 (2015.01 - EP US)
Citation (search report)
See references of WO 2005085808A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005085808 A1 20050915; DE 102004010499 A1 20050922; EP 1723406 A1 20061122; KR 20070003893 A 20070105; US 2008053254 A1 20080306; US 7564033 B2 20090721
DOCDB simple family (application)
DE 2005000040 W 20050114; DE 102004010499 A 20040304; EP 05700543 A 20050114; KR 20067017732 A 20060901; US 56399305 A 20050114