EP 1723670 A1 20061122 - COOLING DEVICE
Title (en)
COOLING DEVICE
Title (de)
KÜHLEINRICHTUNG
Title (fr)
SYSTEME DE REFROIDISSEMENT
Publication
Application
Priority
- EP 2005002068 W 20050226
- DE 102004012026 A 20040311
Abstract (en)
[origin: WO2005088713A1] The invention relates to a cooling device for an electronic unit, in particular, a power supply device, comprising a cooling body (1), arranged in an essentially airtight sealed housing of the electronic unit, through which a cooling medium may flow, mounted on the heat generator (12) which is in particular electronic components, releasing the heat to the cooling body (1) by contact transmission, whereby additional heat exchange means (9.1, 9.2), for cooling the air enclosed in the housing, are connected to the cooling body (1) with a thermal conducting connection and arranged on said cooling body (1). Such a cooling device can be produced with a compact construction with effective heat extraction.
IPC 8 full level
F28F 3/02 (2006.01); F28F 3/12 (2006.01); H01L 23/473 (2006.01); H05K 7/20 (2006.01)
CPC (source: EP KR US)
H01L 23/46 (2013.01 - KR); H01L 23/473 (2013.01 - EP KR US); H05K 7/20927 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Citation (search report)
See references of WO 2005088713A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005088713 A1 20050922; DE 102004012026 B3 20051117; EP 1723670 A1 20061122; JP 2007529883 A 20071025; KR 100874178 B1 20081215; KR 20070007136 A 20070112; US 2007217148 A1 20070920
DOCDB simple family (application)
EP 2005002068 W 20050226; DE 102004012026 A 20040311; EP 05707651 A 20050226; JP 2007502229 A 20050226; KR 20067021052 A 20061010; US 53024206 A 20060908