EP 1725398 A1 20061129 - ADHESIVE BOND AND METHOD FOR THE PRODUCTION THEREOF
Title (en)
ADHESIVE BOND AND METHOD FOR THE PRODUCTION THEREOF
Title (de)
HAFTFESTER VERBUND UND VERFAHREN ZUR HERSTELLUNG
Title (fr)
COMPOSITE ADHESIF ET SON PROCEDE DE PRODUCTION
Publication
Application
Priority
- DE 2005000422 W 20050301
- DE 102004011567 A 20040302
Abstract (en)
[origin: WO2005084940A1] The invention relates to an adhesive bond of a substrate material (1), whose surface and surface-near solid area contain polymer compounds with low active surface energy, and another material (4) and a method for the production of a corresponding adhesive bond. The invention more particularly relates to an adhesive metallized fluoropolymer, such as polytetrafluorethylene (PTFE), as a base material for printed circuit boards having a very high structural density (fine and very fine printed circuit boards) used in the GHz range and to a method for adhesive metallization of a corresponding fluoropolymer. According to the invention, the adhesive bond is formed by a nanostructured transition area (6), containing nanocomposites, between the substrate material (1) and the other material (4), inside which the substrate material (4) which is nanostructured changes into the other material (4). The nanocomposites are composed of substrate material (1) and the other material (4). The material parts of the nanocomposites change from the substrate material (1) in the direction of the other material (1), starting with predominantly substrate material which becomes predominantly the other material (4). According to the invention, the adhesive bond is produced by physically and/or chemically exciting a nano-indented surface of the substrate material (1) and by applying the other material (4) in the form of particles during the excited state until the surface of the other substrate material (1) is fully coated with the other material (4).
IPC 8 full level
B32B 15/08 (2006.01); B32B 5/14 (2006.01); H05K 3/38 (2006.01)
CPC (source: EP KR US)
B32B 5/14 (2013.01 - KR); B32B 7/12 (2013.01 - US); B32B 15/08 (2013.01 - EP KR US); C09J 11/00 (2013.01 - KR); H05K 3/381 (2013.01 - EP US); H05K 3/388 (2013.01 - EP US); H05K 2203/092 (2013.01 - EP US); H05K 2203/095 (2013.01 - EP US); H05K 2203/107 (2013.01 - EP US); Y10T 428/265 (2015.01 - EP US); Y10T 428/31504 (2015.04 - EP US); Y10T 428/3154 (2015.04 - EP US)
Citation (search report)
See references of WO 2005084940A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2005084940 A1 20050915; DE 102004011567 A1 20050922; EP 1725398 A1 20061129; JP 2007526147 A 20070913; JP 2012020583 A 20120202; JP 5379971 B2 20131225; JP 5380496 B2 20140108; KR 101197324 B1 20121105; KR 20060125883 A 20061206; US 2008035266 A1 20080214; US 7955697 B2 20110607
DOCDB simple family (application)
DE 2005000422 W 20050301; DE 102004011567 A 20040302; EP 05715086 A 20050301; JP 2007501114 A 20050301; JP 2011156703 A 20110715; KR 20067017864 A 20050301; US 58929305 A 20050301