EP 1726063 B1 20070704 - MICROWAVE ANTENNA FOR FLIP-CHIP SEMICONDUCTOR MODULES
Title (en)
MICROWAVE ANTENNA FOR FLIP-CHIP SEMICONDUCTOR MODULES
Title (de)
MIKROWELLENANTENNE FÜR IN FLIP-CHIP-TECHNOLOGIE HERGESTELLTE HALBLEITERBAUGRUPPEN
Title (fr)
ANTENNE A MICRO-ONDES DESTINEE A DES MODULES A SEMICONDUCTEURS A PUCES RETOURNEES
Publication
Application
Priority
- EP 2005003303 W 20050316
- DE 102004014018 A 20040319
Abstract (en)
[origin: US2008238792A1] The invention relates to a microwave antenna for flip-chip semiconductor modules, comprising two semiconductor substrates which are metallized on the surface thereof. Patch antennas, i.e. metallized flat areas which are insulated from the rest of the circuit on an outer surface of a module with a supply line to the circuit, are already known per se. They result in vertical radiation at a relatively large angle. According to the invention, a closed group of bumps are arranged in such a way that the distance of the bumps ( 2 ) to each other is less than the half wavelength (lambda/2) of the microsignal which is to be radiated or received and an open radiation slot arises in at least one pair of side walls ( 3,4 ) of the semiconductor substrates (a,b) and a bump, which is connected to the circuit of the semiconductor module, is arranged between the bumps ( 2 ) and the radiation slot, enabling the microwave antenna to be excited.
IPC 8 full level
H01Q 23/00 (2006.01); H01Q 1/38 (2006.01); H01Q 13/02 (2006.01); H01Q 13/18 (2006.01); H01Q 19/32 (2006.01); H01Q 21/00 (2006.01)
CPC (source: EP US)
H01Q 1/2283 (2013.01 - EP US); H01Q 1/38 (2013.01 - EP US); H01Q 13/02 (2013.01 - EP US); H01Q 13/0283 (2013.01 - EP US); H01Q 13/18 (2013.01 - EP US); H01Q 19/32 (2013.01 - EP US); H01Q 21/0093 (2013.01 - EP US); H01Q 23/00 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2008238792 A1 20081002; US 7612728 B2 20091103; AT E366465 T1 20070715; DE 102004014018 B3 20050811; DE 502005000985 D1 20070816; EP 1726063 A1 20061129; EP 1726063 B1 20070704; JP 2007529930 A 20071025; WO 2005091438 A1 20050929
DOCDB simple family (application)
US 59333705 A 20050316; AT 05728358 T 20050316; DE 102004014018 A 20040319; DE 502005000985 T 20050316; EP 05728358 A 20050316; EP 2005003303 W 20050316; JP 2007503307 A 20050316